Functional Description And Connections; Figure 3-2. Launchpad Power Distribution Diagram - Texas Instruments C2000 F28003x Series User Manual

Hardware Description

3.1 Functional Description and Connections

3.1.1 Microcontroller
The TMS320F280039CSPZ is a 32-bit floating-point microcontroller with 384KB Flash memory, 69KB RAM,
a programmable Control Law Accelerator (CLA) for offloading tasks, and operates at 120 MHz. It includes
advanced control peripherals, differentiated analog, and various communications peripherals. The device has
been optimized for high-performance real-time control applications. For more details, see the
Real-Time Microcontrollers Data
Most of the microcontroller's signals are routed to 0.1 inch (2.54 mm) pitch headers laid out to comply with
the TI BoosterPack standards, with a few exceptions. The F28003x MCU's internal multiplexer allows different
peripheral functions to be assigned to each of the General-Purpose Input/Output (GPIO) pins. The multiplexing
options can be found in the device-specific data sheet. When adding external circuitry, consider the additional
load on the development board's power rails.
The F28003x LaunchPad is factory-programmed with a quick start demo program. The quick start program
resides in the on-chip Flash memory and executes each time power is applied, unless the application has been
replaced with a user program. For details on the LaunchPad's demo program, see
3.1.2 Power Domains
The F28003x LaunchPad has several power domains that can be connected or isolated from each other with
removable shunts. The different 3.3 V and 5 V power domains are further described in
3-3.
+5V0_USB
USB Type-C™
Conn
™
10 C2000 F28003x Series LaunchPad
Sheet.
USB
Isolator
Device
+5V0_XDS110
+5V0
Shunt 1
JP1
+5V0 and GND shunts to enable
GND
or break isolation boundary
Shunt
XDS110 Side
PWR & GND
Isolation Boundary
MCU Side
+5-V power can flow
from either the
XDS110 or MCU
sides

Figure 3-2. LaunchPad Power Distribution Diagram

™
Development Kit
Copyright © 2022 Texas Instruments Incorporated
Section
Figure 3-2
+3V3_XDS110
3.3-V Power
Management
+3V3_XDS110
+5V0 +3V3
+5V0
Shunt 2 Shunt
JP2
+5V0_MCU +3V3_MCU
Shunts to disconnect +5 V
and/or +3.3 V between
XDS110 and MCU sides
www.ti.com
TMS320F28003x
2.2.
and Figure
+3.3-V power
only flows from
XDS110 to MCU
side
5-V & 3.3-V Isolation
+3V3
Boundary
SPRUJ31 – APRIL 2022
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