Specifications; Al120-L6-150 And Lmb6-150 - Olympus AL120-6 Series Operation Manual

Operation Manual

4 Specifications

4-1 AL120-L6-150 and LMB6-150

Item
1. Transferable Wafer Size
Applicable SEMI
standard
Applicable wafer
diameter
Applicable wafer
thickness
Wafer deflection in a
cassette
Applicable wafer
warpage
Applicable wafer material
Applicable positioning
shape
Transferable wafer
weight
2. Settable Cassette
Applicable cassette
Number of settable
cassettes
Cassette positioning
Maximum withstand load
3. Macro Inspections
Top Macro inspection
Back Macro inspection
2nd Back Macro
inspection
Inspection time setting
AL120-L6-150
SEMI M1-1105
Class 1.8: 150 mm mirror-polished single-crystal silicon wafer (with secondary flat)
Class 1.13: 150 mm mirror-polished single-crystal silicon wafer
150  0.2 mm
t = 675 um to 150 um (Wafers in a cassette must have uniform thickness and deflection.)
2 mm or less
(Wafers in a cassette must have uniform thickness and deflection.)
0.1 mm or less
Silicon
Orientation flat
Class 1.8 = Primary flat length 57.5  2.5 mm and secondary flat length 37.5  2.5 mm
Class 1.13 = Primary flat length 47.5  2.5 mm
As per the SEMI M1-1105 standard (28 g for a 150mm wafer)
150 mm plastic and metal wafer carrier that conforms to the SEMI E1.5-91 150 standard
Standard cassette: Entegris PA182-60MB-06
* You may need to adjust the cassette guide when using other types of cassettes.
1 cassette (for both loading and unloading)
Drop-in type
with a positioning guide adjustment function
2.0 kg (150mm wafers(25) + Cassette)
Not available
Not available
Not available
Not available
Specifications
AL120-LMB6-150
Tilt drive type: Joystick direct drive
Tilt angle: 30 degrees (max.)
Wafer rotation direction: Clockwise, counterclockwise, and
non rotating
Wafer rotation speed: 3 to 30 seconds/rotation (continuously
variable)
Tilt drive type: Motorized drive
Tilt angle: 360 degrees from horizon (stepless)
Angle can be changed during inspection.
Registered tilt positions: 2 positions
After the Back Macro inspection, the wafer is rotated
counterclockwise about 20 degrees and inspected again.
From 0 to 8 seconds and 
The  setting maintains the inspection state.
Time can be set in 1 second steps.
/ AL120-L6-150 and LMB6-150
4-1
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