Design Considerations - Quectel SC606T Series Hardware Design

MCAM_ RST
MCAM_PWDN
MCAM_MCLK
CAM_I2C_SDA
CAM_I2C_SCL _
CSI0_LN3_P
CSI0_LN3_N
CSI0_LN2_P
CSI0_LN2_N
CSI0_LN1_P
CSI0_LN1_N
CSI0_LN0_P
CSI0_LN0_N
CSI0_CLK_P
CSI0_CLK_N
S CAM_ RST
S CAM_ PWDN
S CAM_ MCLK
CSI2_ CLK_P
CSI2_ CLK_N
CSI2_LN0_P
CSI2_LN0_N
CSI2_LN1_P
CSI2_LN1_N
CSI1_LN0_P
CSI1_LN0_N
CSI1_CLK_P
CSI1_CLK_N
DCAM_RST
DCAM_PWDN
DCAM_MCLK
DCAM_I2C_SDA _
DCAM_I2C_SCL
Figure 23: Reference Design for Triple Camera Application

3.18.1. Design Considerations

⚫
Pay attention to the pin definitions of L CM and camera connectors to ensure the module and the
connectors are connected correctly.
⚫
MIPI is a high-speed signal line whose data rate reaches 2.1 Gbps. The differential impedance
should be kept at 100 Ω, and the trace be routed on the inner layer of PCB and not crossed with other
SC606T_Series_Hardware_Design
AF_ VDD
LDO17_2P85
LDO22_2P8
LDO2_1P1
LDO6_1P8
EMI
EMI
EMI
EMI
EMI
1 μ F
4.7 μ F
LDO23_1P2
1 μ F
EMI
EMI
EMI
μ F
4.7
1 μ F
EMI
EMI
2.2K
2.2K
Smart Module Series
SC606T Series Hardware Design
AVDD
DVDD
DOVDD
DOVDD
AVDD
DVDD
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