Connectors; Data Contacts/Local Bus; Figure 2: Data Contacts - WAGO 750-1416/040-000 Manual

8di 24 vdc 0.2ms 2-wire xtr 0.2 ms; 2-conductor connection; extreme for wago i/o system 750 xtr
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WAGO I/O SYSTEM 750 XTR
750-1416/040-000 8DI 24 VDC 0.2ms 2-wire XTR
Pos : 25 /All e Seri en (Allgemei ne Module)/Ü berschriften/Ebene 2/Ansc hlüss e - Übersc hrift 2 @ 4\mod_1240984262656_21.doc x @ 31961 @ 2 @ 1
3.2

Connectors

Pos : 26 /Serie 750 ( WAGO-I/O-SYST EM)/Ger ätebesc hrei bung (alte Str uktur)/Ansc hlüsse/Datenkontakte/Lokalbus - Ü berschrift 3 @ 6\mod_1256294684083_21.doc x @ 43660 @ 3 @ 1
3.2.1

Data Contacts/Local Bus

Pos : 27.1 /Serie 750 (WAGO-I/O-SYST EM)/Ger ätebesc hrei bung (alte Str uktur)/Ansc hlüs se/Datenkontakte - Fel dbus koppl er/-c ontroller und Modul e – Abbildung und Besc hrei bung @ 3\mod_1231771259187_21.doc x @ 26002 @ @ 1
Communication between the fieldbus coupler/controller and the I/O modules as
well as the system supply of the I/O modules is carried out via the local bus. The
contacting for the local bus consists of 6 data contacts, which are available as
self-cleaning gold spring contacts.

Figure 2: Data Contacts

Pos : 27.2 /Serie 750 (WAGO-I/O-SYST EM)/Wic htige Erläuterungen (al te Str uktur)/Sic herheits- und s onstige Hinweise/Achtung/Ac htung: I/O-Module nic ht auf Gol dfeder kontakte legen! @ 7\mod_1266318463636_21.doc x @ 50695 @ @ 1
Do not place the I/O modules on the gold spring contacts!
Do not place the I/O modules on the gold spring contacts in order to avoid soiling
or scratching!
Pos : null /Serie 750 (WAGO-I/O-SYST EM)/Wichtige Erläuter ung en (alte Str uktur)/Sic her hei ts- und s onstige Hi nweise/Ac htung/Ac htung: ESD - Auf Potenti alausgleic h der U mg ebung ac hten! @ 32\mod_1539077262331_21.doc x @ 504433 @ @ 1
Pay attention to potential equalization from the environment!
The devices are equipped with electronic components that may be destroyed by
electrostatic discharge. When handling the devices, please ensure that
environmental factors (personnel, work space and packaging) are properly
equalized. Do not touch any conducting parts, e.g., data contacts.
Pos : 28 /D okumentation allgemei n/Glieder ungs elemente/---Seitenwechs el--- @ 3\mod_1221108045078_0.doc x @ 21810 @ @ 1
Device Description
Manual
Version 1.1.0
17

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