Quectel SC66 Hardware Design page 6

8.2. Recommended Footprint ........................................................................................................ 131
8.3. Top and Bottom View of the Module ....................................................................................... 132
9 Storage, Manufacturing and Packaging ........................................................................................ 133
9.1. Storage .................................................................................................................................... 133
9.2. Manufacturing and Soldering .................................................................................................. 134
9.3. Packaging ............................................................................................................................... 135
10 Appendix A References ................................................................................................................... 137
11 Appendix B GPRS Coding Schemes ............................................................................................. 140
12 Appendix C GPRS Multi-slot Classes ............................................................................................ 141
13 Appendix D EDGE Modulation and Coding Schemes ................................................................. 143
SC66_Hardware_Design
Smart LTE Module Series
SC66 Hardware Design
5 / 139