Nokia Mobile Phones NSE-5 Series Service Manual page 23

PAMS
Technical Documentation
Pin IB- Name Function
pin
8 Yes XMIC Analog
audio in- audio in-
put
(from ac-
cessory to cessory to
phone)
Headset
micro- micro-
phone in-
put
(from ac- (from ac-
cessory to
phone) hone)
Accessory
mute.
Voltage
compared compared
to SGND.
(from
phone to hone to
accesso-
ry)
Headset
detection d t ti
(from
accessory to accessory to
phone)
(NO TAG)
9 Yes SGND Audio sig-
nal a
ground.
Separated Separated
from
phone hone
GND
(from
phone to phone to
accesso-
ry) ry)
Issue 1 07/99
Table 3. System/IBI connector
Min Typ Max
2.0
100
2.0
2.5
100
2.5
0 1.55
1.6 2.0
1.47
0 1.33
49
47
d
10
380
100
–0.2 +0.2
–5
(continued)
Unit Description
2.2 k Input AC impedance
Accessory source AC imped-
ance
1 V Maximum signal level
p–p
2.2 k Input AC impedance
k Headset source AC imped-
ance
mA
600 Bias current
200 mV- Maximum signal level
p–p
2.9 V Not muted
V Muted, without headset
2.4 V Comparator reference in ac-
cessory
2.9 V No headset (ref. SGND).
V Headset connected (ref.
SGND).
k Pull–up resistor to VBB in
phone
Output AC impedance (ref.
GND)
mF
Series output capacitance
Resistance to phone ground
(DC) (in phone)
k Resistance to accessory
ground (in accessory)
V DC voltage compared to
phone GND
+5 V DC voltage compared to ac-
cessory GND
NSE–5
System Module
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