Thermal Considerations; Cpu Die Temperature; Thermal Options - VersaLogic Hawk Reference Manual

Thermal Considerations

CPU Die Temperature

The CPU die temperature is affected by numerous conditions, such as CPU utilization, CPU
speed, ambient air temperature, air flow, thermal effects of adjacent circuit boards, external heat
sources, and many others.
The thermal management for the Intel Atom E38xx series of processors consists of a sensor
located in the core processor area. The processor contains multiple techniques to help better
manage thermal attributes of the processor. It implements thermal-based clock throttling and
thermal-based speed step transitions. There is one thermal sensor on the processor that triggers
Intel's thermal monitor (the temperature at which the thermal sensor triggers the thermal monitor
is set during the fabrication of the processor). Triggering of this sensor is visible to software by
means of the thermal interrupt LVT entry in the local APIC. (See the
E3800 Series Datasheet

Thermal Options

The following thermal options are available for the Hawk:

VL-HDW-405 – Secondary 75 mm x 84 mm mounting plate. Attaches to heat plate on
standard product. Refer to page 11 for more information.

VL-HDW-406 – Passive heat sink to mount on product heat plate

VL-HDW-408 – Heat pipe connector plate. Mounts to standard product

VL-HDW-411 – Cooling fan for HDW-406 passive heatsink. Operates at 12 V and
includes an ATX-style connection
VL-EPU-3310 Reference Manual
for complete information.)
Introduction
Intel Atom Processor
6