Mounting Example With Heat Sink - SIEB & MEYER SD2 Hardware Description

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Mounting Example with Heat Sink

Devices without integrated heat sink (0362110xxy, 0362111xy, 0362111MF,
0362112xxy, 0362130xxy and 0362190y) are cooled via the rear panel. In order to
ensure optimum cooling a heat sink must be mounted.
The used kind of cooling system must be suitable for the application. Insufficient
cooling may cause damage to the devices due to overheating.
The following sections describe 3 examples of device mounting with heat sink.
For better heat conductance, use adequate heat-conductive paste.
Drive System SD2 - Hardware Description
Mounting Example with Heat Sink
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