Pin
Signal
No
39
GND
1. Population option changes are necessary in order to use this signal. See the carrier board
schematic (R-3) for more details.
For more details regarding configuring the GPIOs on this header, refer to the Open-Q 865XR Software
Release Notes to determine feature support in the latest software release.
3.7.22
Audio Headset Jack J1700 (8)
In addition to the audio expansion headers, the Open-Q 865XR SOM Development Kit also includes a
standard 3.5mm audio headset jack J1700, which provides connection to headphone, microphone input
and headset detection circuits. See item 8 in Figure 1 for the carrier board location of this headset jack.
3.7.23
WLAN / BT Antenna Connections (13, 14)
The Open-Q 865XR SOM Development Kit WLAN/BT functionality is based on Qualcomm QCA6391
chipset. It provides WLAN/Bluetooth in 2x2 MIMO with two spatial streams IEEE802.11 a/b/g/n/ac/ax
WLAN standards, and Bluetooth + LE 5.x + HS enabling seamless integration of WLAN/Bluetooth and
low energy technology.
The QCA6391 chipset is located on the SOM, which has U.FL coax connectors for channel 0 (WLAN+BT)
and channel 1 (WLAN only). These connectors are mated to the Carrier board WLAN / BT PCB antennas
via coax cables. Figure 1 in 3.4.1 above shows how the two WLAN / BT are routed via the coax cables:
For channel 0 (WLAN+BT), see items 31 and 13 on Figure 1.
•
For channel 1 (WLAN only), see items 32 and 14 on Figure 1.
•
If a more advanced antenna solution is required, it is possible to connect custom antennas directly to the
SOM U.FL connectors.
3.7.24
Quiet Thermistor RT800 (34)
The Open-Q 865XR SOM Development Kit includes a thermistor on the carrier board to allow for system
level thermal management. See item 34 in Figure 1 for the carrier board location of the Quiet Thermistor
RT800.
Open-Q 865XR SOM Development Kit User Guide
Description
System Ground
3: Open-Q 865XR SOM Development Kit
Pin
Signal
No
40
No Net
Description
No Net
38
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