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6.5
Equipotential bonding
A low-impedance ground connection ensures that interference signals generated by external
power supply cables, signal cables or cables to the I/O modules are safely discharged to
ground.
Equipotential bonding strip
Connect the equipotential bonding strip
on the device (large surface, large-area
contact) with the central grounding
point of the cabinet or system in which
the PC is installed.
The minimum conductor cross-section
must be at least 5 mm
SIMOTION P350-3 and Panels
Manual, 05/2009
.
2
Connection
6.5 Equipotential bonding
103
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