Technical Specifications - Seco Qseven Q7-974 User Manual

Rel. 2.0 comliant module with the intel bay trail family system-on-chips
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2.2 Technical Specifications

System-On-Chips
®
Intel
Atom E3845, Quad Core @1.91GHz, 2MB Cache, 10W TDP
®
Intel
Atom E3827, Dual Core @1.75GHz, 1MB Cache, 8W TDP
®
Intel
Atom E3826, Dual Core @1.46GHz, 1MB Cache, 7W TDP
®
Intel
Atom E3825, Dual Core @1.33GHz, 1MB Cache, 6W TDP
®
Intel
Atom E3815, Single Core @1.46GHz, 512KB Cache, 5W TDP
Intel
®
Celeron
®
J1900, Quad Core @2.0GHz, 2MB Cache, 10W TDP
Intel
®
Celeron
®
N2930, Quad Core @1.83GHz, 2MB Cache, 7.5W TDP
®
®
Intel
Celeron
N2807, Dual Core @1.58GHz, 1MB Cache, 4.3W TDP
Memory
Soldered down DDR3L memory
E3845, E3827, J1900, N2930: up to 8GB Dual-Channel DDR3L @ 1333MHz
E3826: up to 8GB Dual-Channel DDR3L @ 1066MHz
N2807: up to 4GB Single-Channel DDR3L @ 1333MHz
E3825, E3815: up to 4GB Single-Channel DDR3L @ 1066MHz
Graphics
®
Integrated Intel
HD Graphics 4000 series controller
Dual independent display support
HW decoding of H.264, MPEG2, MVC, VC1, VP8, MJPEG formats
HW encoding of H.264, MPEG2 and MVC formats
Video Interfaces
HDMI or Multimode Display Port interface
Embedded Display Port or 18/24 bit dual channel LVDS interface
Additional VGA interface (optional external adapter is required)
Video Resolutions
HDMI:
Up to 1920x1080p@60Hz
Display Port, eDP, CRT:
Up to 2560x1600@60Hz
Optional LVDS interface:
Up to 1920x1200@60Hz
Mass Storage
Up to 2 x external S-ATA channels
SD interface
Optional SATA Flash Disk soldered onboard
USB
1 x USB 3.0 Host Port
6 x USB2.0 Host ports (one shared with USB 3.0 interface)
Networking
Gigabit Ethernet interface
Audio
HD Audio interface
PCI Express
3 x PCI-e x1 lanes
Serial Ports
1 x Serial port (TTL interface)
Other Interfaces
I2C bus
LPC Bus
SM Bus
Thermal / FAN management
SPI interface
Power Management Signals
Power supply voltage: +5V
± 5%
DC
Operating temperature:
0°C ÷ +60°C (commercial version) **
-40°C ÷ +85°C (industrial version) **
"
Dimensions: 70 x70 mm (2.76
x 2.76
** Temperatures indicated are the minimum and maximum temperature that
the heatspreader / heatsink can reach in any of its parts. This means that it is
'
customer
s responsibility to use any passive cooling solution along with an
application-dependent cooling system, capable to ensure that the
heatspreader / heatsink temperature remains in the range above indicated.
Please also check paragraph 5.1
"
)

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