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Summary of Contents for Seco COMe-C55-CT6
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COMe-C55 COM-Express Type 6 Module with the ® Intel generation Core and Celeron 4000 CPUs...
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SECO S.p.A. reserves the right to change precise specifications without prior notice to supply the best product possible. For further information on this module or other SECO products, but also to get the required assistance for any and possible issues, please contact us using the dedicated web form available at http://www.seco.com (registration required).
Rel.3.0 standard compliant, an open industry standard defined specifically for COMs (computer on modules). Its definition provides the ability to make a smooth transition from legacy parallel interfaces to the newest technologies based on serial buses available. Specifically, COMe-C55-CT6 is a ®...
** Temperatures indicated (minimum and maximum) are those measured at any point Optional eMMC 5.1 drive on-board of SECO standard heat-spreader for this product, during any and all times (including Up to 3 x S-ATA Gen3 channels microSD card slot on-board start-up).
Power Consumption COMe-C55-CT6 module, like all COM Express modules, needs a carrier board for its normal working. All connections with the external world come through this carrier board, which provide also the required voltage to the board, deriving it from its power supply source.
3.2.3 microSD Card Slot CPUs used on the COMe-C55-CT6 board provide a SDXC 3.01 compliant controller, that can be used to implement another mass storages media other than the optional internal eMMC and the SATA interfaces (up to three). -push type 3.2.4...
COMe-C55-CT6 board. Therefore, please refer to the following table for a list of effective signals reported on the connector. For accurate signals description, please consult the following paragraphs.
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3.2.5.1 Audio interface signals The COMe-C55-CT6 module supports HD audio format, thanks to native support offered by the processor to this audio codec standard. Up to 3 HD audio codecs on the carrier board can be supported. Here following the signals related to HD Audio interface: HDA_SYNC: HD Audio Serial Bus Synchronization.
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The customer acknowledges and agrees to the conditions set forth that these schematics are provided only as an example and that he will conduct an independent analysis and exercise judgment in the use of any and all material. SECO declines all and any liability for use of this or any other material in the customers’...
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3.2.5.4 PCI Express interface signals On COMe-C55-CT6 module, the SoC’s embedded PCH can manage eight PCI Express lane, one of which is used to manage the optional Gigabit Ethernet controller. PCI express Gen3 (8GT/s) is supported. These PCI-express lanes can be switched to support single PCI-e lanes, the third SATA port and the PCI-e Graphics interface.
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PEG interface signals In addition to the eight PCI express lanes, described in the previous paragraph, the COMe-C55-CT6 module can offer a PCI-Express x2 or x4 graphics interface (PEG), which can be used for connection of external graphics cards. Such an interface is directly managed by the SoC’s embedded PCH.
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Display Port (eDP). Conversely, the LVDS interface, which is frequently used in many application fields, is not directly supported by these CPUs. For this reason, considering that LVDS interface can be multiplexed on the same pin with the eDP interface, on COMe-C55-CT6 module can be implemented an eDP to LVDS bridge (NXP PTN3460), which allow the implementation of a Dual Channel LVDS, with a maximum supported resolution of 1920x1200 @ 60Hz (dual channel mode).
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VGA/CRT displays. As a factory option, however, it is possible to purchase COMe-C55-CT6 modules equipped with a DP to VGA bridge (NXP PTN3356BS), which allow the implementation of a VGA interface with a maximum supported resolution of 2048x1536 @ 50Hz (reduced blanking).
Configuration straps are signals that, during system reset, are set as inputs (independently by their behaviour during normal operations) in order to allow the proper configuration of the processor / PCH. For this reason, on COMe-C55-CT6 are placed the pull-up or pull-down resistors that are necessary to configure the board properly.