Technical Specifications - Seco SM-C12 User Manual

Smarc rel. 2.0 compliant module with nxp i.mx 8m applications processors
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2.2 Technical Specifications

Processors
NXP i.MX 8M Family based on ARM Cortex®-A53 cores + general purpose
Cortex®-M4 processor:
-
i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz
-
i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz
-
i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU
Memory
Soldered Down LPDDR4-3200 memory, 32-bit interface, up to 4GB
Graphics
Integrated Graphics Processing Unit, supports 2 independent displays.
Embedded VPU (not available on QuadLite), supports H/W decoding of HEVC,
H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG
Supports OpenGL ES 3.1, Open CL 1.2, OpenGL 2.X, Vulkan, DirectX, Open VG
1.1
Video Interfaces
1 x HDMI 2.0a interface, supporting HDCP 2.2 and HDCP 1.4
1 x LVDS 18/24-bit Dual Channel or 1 x MIPI-DSI interface (factory alternatives)
Video Resolution
HDMI, resolution up to 4096x2160 @ 60Hz
MIPI-DSI, LVDS, resolution up to 1920x1080 @ 60Hz
Mass Storage
eMMC 5.0 Drive soldered on-board
Optional SD 4-bit interface
8MB QuadSPI Flash
PCI Express
2 x PCI-e x1 Gen2 ports
Networking
1 x Gigabit Ethernet interface
Optional WiFi + BT LE module onboard
USB
1 x USB 2.0 OTG port
USB 3.0 Hub onboard, makes available
-
2 x USB 2.0 ports
-
2 x USB 3.0 Superspeed ports
Audio
I2S Audio interface
Serial ports
Up to 2x UART Tx/Rx/RTS/CTS
2x UART Tx/Rx
1x CAN Bus
Other Interfaces
1x 4-lanes + 1x 2-lanes CSI camera interfaces
I2C Bus
SM Bus
2x SPI interfaces
QuadSPI interface
12 x GPI/Os
Boot select signals
Power Management Signals
Power supply voltage: +5V
DC
RTC voltage: 3.3V
Operating temperature:
Commercial version 0°C ÷ +60°C **.
Industrial version -40°C ÷ +85°C **.
"
Dimensions: 50 x82 mm (1.97
x 3.23
** Measured at any point of SECO standard heatspreader for this product,
during any and all times (including start-up). Actual temperature will widely
depend on application, enclosure and/or environment. Upon customer to
consider application-specific cooling solutions for the final system to keep the
heatspreader temperature in the range indicated.
Please also check paragraph 4.1
"
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