Examining The Installation Site; Weight Support; Temperature And Humidity - H3C SecPath U200 Series Installation Manual

Unified threat management products
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If the UTM device needs to be moved over a long distance, remove all field-replaceable units
(FRUs), such as interface modules, and package them separately, and install the filler panels
supplied with UTM device.
If the UTM device needs to be moved over a short distance, make sure all FRUs are securely seated
in slot and the screws are fastened.
Make sure the accessories of the UTM device are not lost or damaged during UTM device moving.
Make sure the ground is dry and flat and anti-slip measures are in place.
Keep the chassis and installation tools away from walk areas.
Only trained and qualified personnel are allowed to install or service the UTM device.

Examining the installation site

The UTM devices must be used indoors. To ensure normal operation and long service life of your UTM
device, the installation site must meet the requirements in this section.

Weight support

Make sure the floor can support the total weight of the rack, chassis, cards, and all other components.
For more information, see

Temperature and humidity

Maintain appropriate temperature and humidity in the equipment room.
Lasting high relative humidity can cause poor insulation, electricity creepage, mechanical property
change of materials, and metal corrosion.
Lasting low relative humidity can cause washer contraction and ESD and bring problems including
loose captive screws and circuit failure.
High temperature can accelerate the aging of insulation materials and significantly lower the
reliability and lifespan of the UTM device.
For the temperature and humidity requirements of the UTM device, see
Table 2 Temperature requirements
Item
Operating temperature
Storage temperature
Table 3 Humidity requirements
Item
Operating humidity
Storage humidity
"Dimensions and
weight."
Temperature
0°C to 45°C (32°F to 113°F)
–40°C to +70°C (–40°F to +158°F)
Relative humidity
10% to 95%, noncondensing
5% to 95%, noncondensing
7
Table
2.

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