Figure 2.11Illustration Of The Heat Spreader Assembly - Advantech MIO-2270 User Manual

Amd g-series soc gx-210ja/ gx-415ga pico-itx sbc, ddr 3/3l, 18-bit lvds, vga or hdmi, 1gbe, half-size mini pcie, 4 usb, 2 com, smbus, msata & mioe

Hide thumbs Also See for MIO-2270:

Table of Contents

2.3.2.3

Another Thermal Solution - Heat Spreader

MIO-2270 can accommodate an optional heat spreader, facilitating a more compact

total system. Using a heat spreader to conduct heat to the chassis is extremely bene-

ficial when systems are extra compact or have limited space for heat convection.

Below are guidelines for heat spreaders:

For optimum heat conduction, only a small gap should exist between the chas-

sis and heat spreader; the smaller this gap, the better.

Presently, the height of our heat spreader is 11.2 mm (Advantech P/N:

1960065075N001). However, should you require a heat spreader of another

height to better fit chassis, Advantech can customize this for you. Please con-

tact our sales center for further details.

The heat spreader kit contains thermal grease and screws. Thermal grease

enables superior conduction if the chassis is near to the heat spreader. Other-

wise, we recommend using a thermal pad if the chassis is too far from the heat

spreader. The recommended gap is less than 3 mm for superior heat conduc-

tion.

Figure 2.11 Illustration of the heat spreader assembly

MIO-2270 User Manual

Table of Contents