Figure 2.8 Illustration Of Heat Spreader Assembly - Advantech MIO-2260 User Manual

Mi/o-ultra sbc with intel atom n455, ddr3, 18-bit lvds, vga, gbe, mini pcie, 2 com, 2 usb, mioe
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2.3.2.3
Another Thermal Solution - Heat Spreader
MIO-2260 has an optional heat spreader to make whole system more compact.
Using a heat spreader to conduct heat to your chassis can help a lot when system is
extra compact or limited space for heat convection. Here are some guidelines for
heat spreader:
1.
For best heat conduction, the gap between chassis and heat spreader should
be the smaller, the better.
2.
The height of exsting heat spreader is 11.2mm (Advantech P/N:
1960053176T001). If you need some other height to fit chassis better, Advan-
tech could custormize it for you. (Please contact our sales for details)
3.
There are thermal grease and screws in heat spreader kit, thermal grease helps
conduct better if chassis is quite close to heat spreader. Another suggestion is
to use thermal pad if chassis isn't close enough to heat spreader. (The gap is
suggested less than 3mm for better heat conduction and cost effective)
MIO-2260 User Manual

Figure 2.8 Illustration of heat spreader assembly

16

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