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1.2.3
BIOS
Dual 8M-Byte SPI flash contains a board-specific BIOS (from AMI) designed to meet
industrial and embedded system requirements.
1.2.4
Chipset
®
The Intel
Mobile PCH DH8900 chipset provides excellent flexibility for developers of
embedded applications by offering up to 5 GT/s for fast access to peripheral devices.
It delivers outstanding system performance through high bandwidth interfaces such
as PCI Express, Serial ATA and USB 2.0.
1.2.5
Memory
The MIC-3397 has up to 8 GB of onboard DDR3 memory and one 204-pin unbuf-
fered DDR3 SO-DIMM sockets up to 8GB memory with ECC support. The following
table shows a list of SO-DIMM modules that have been tested on the MIC-3397.
Brand
Size
ATP
4GB
Memphis
4GB
Hynix
4GB
8GB
Memphis
(Extended
temperature)
Memphis
8GB
ATP
8GB
Transcend
8GB
Note!
If you don't have above SO-DIMM module on hand, please make sure
your module is compatible with what Intel validated configurations as
below.
Unbuffered/ECC Supported SO-DIMM Module Configurations
DIMM
DRAM Device
Capacity
Technology
4GB
2GB
8GB
4GB
1.2.6
Ethernet
The MIC-3397 uses one Intel
Ethernet connectivity (LAN1) and four Marvell 88E1112 LAN PHY chips with inte-
grated LAN MAC in PCH DH8900 to provide 10/100/1000 Mbps Ethernet connectiv-
ity (LAN2 ~ LAN5) via rear I/O. Optional settings for the source of each individual
MIC-3397 User Manual
Speed
Vendor PN
DDR3-1600
AW12M7228BKK0S
DDR3-1600
D3SO512M726G-A28MTK
DDR3-1600
D3XH56082XH12AA
DDR3-1600
D3SO1G726GI-A58MA
DDR3-1600
D3SO1G726G-A58MA
DDR3-1600
AW24M7228BLK0S
DDR3-1600
TS1GSK72V6H
DRAM
# of DRAM
Organization
Devices
256 M X 8
18
512 M X 8
18
®
I210AT GbE Controller to provide 10/100/1000 Mbps
4
ECC Memory Chip
Samsung 256Mx8
Yes
DDR3 2-ranks
Memphis 256Mx8
Yes
DDR3 2-ranks
Hynix 256Mx8 DDR3
Yes
2-ranks
Memphis 512Mx8
Yes
DDR3 2-ranks
Memphis 512Mx8
Yes
DDR3 2-ranks
Samsung 512Mx8 2-
Yes
ranks
Samsung 512Mx8 2-
Yes
ranks
# of Physical
# of Banks Inside
Device Ranks
DRAM
2
8
2
8
Page
Size
8 K
8 K
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