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Thermal/Mechanical Reference Design
Figure 2-21. 1U CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor E5400
Series Thermal Profile
65
60
55
50
45
40
35
0
Note:
Intel has also developed an 1U alternative reference heatsink design. This
alternative heatsink design meets the thermal profile specifications of the
Quad-Core Intel® Xeon® Processor E5400 Series and offers the advantages of
weight reduction and cost savings. Refer to
2.5.7
Components Overview
2.5.7.1
Heatsink with Captive Screws and Standoffs
The CEK reference heatsink uses snapped-fin technology for its design. It consists of a
copper base and copper fins with Shin-Etsu* G751 thermal grease as the TIM. The
mounting screws and standoffs are also made captive to the heatsink base for ease of
handling and assembly as shown in
heatsinks, respectively.
Quad-Core Intel® Xeon® Processor 5400 Series TMDG
@ TDP
T
CASE_MAX
Thermal Profile
Y = 0.298 * X + 43.2
5
10
15
20
25
30
1U CEK Reference Solution
Y = 0.246 * X + 40
45
55
35
40
50
Appendix B
Figure 2-22
and
Figure 2-23
60
65
70
75
80
for detail information.
for the 2U+ and 1U
45
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