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Thermal/Mechanical Reference Design
Figure 2-20. 1U CEK Thermal Adherence to Dual-Core Intel Xeon Processor 5160 Thermal
Profile B
T
T
CASE MAX_B
CASE MAX_B
TDP
TDP
T
T
CASE_MAX
CASE_MAX
P
P
_PROFILE_MIN
_PROFILE_MIN
2.4.7
Components Overview
2.4.7.1
Heatsink with Captive Screws and Standoffs
The CEK reference heatsink uses snapped-fin technology for its design. It consists of a
copper base and copper fins with Shin-Etsu* G751 thermal grease as the TIM. The
mounting screws and standoffs are also made captive to the heatsink base for ease of
handling and assembly as shown in
heatsinks, respectively.
Figure 2-21. Isometric View of the 2U+ CEK Heatsink
Note:
Refer to
Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide
70
70
@
@
60
60
Thermal Profile B
Thermal Profile B
y = 0.282 * x + 42.4
y = 0.282 * x + 42.4
@
@
50
50
40
40
30
30
20
20
10
10
0
0
0
0
10
10
20
20
Appendix A
for more detailed mechanical drawings of the heatsink.
1U CEK Reference Solution
1U CEK Reference Solution
y = 0.299 * x + 40
y = 0.299 * x + 40
30
30
40
40
50
50
P
P
_PROFILE_MIN
_PROFILE_MIN
Power [W]
Power [W]
Figure 2-21
and
Figure 2-22
60
60
70
70
80
80
TDP
TDP
for the 2U+ and 1U
43
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