Separate The Processor From Carrier And Heat Sink - Lenovo HR650X V2 User Manual

• If you are reusing the processor or heat sink, separate the processor from its retainer. See "Separate the
processor from carrier and heat sink" on page 102
• If you are instructed to return the defective component, please package the part to prevent any shipping
damage. Reuse the packaging the new part arrived in and follow all packaging instructions.

Separate the processor from carrier and heat sink

This task has instructions for separating a processor and its carrier from an assembled processor and heat
sink, known as a processor-heat-sink module (PHM). This procedure must be executed by a trained
technician.
About this task
Attention:
• Read "Installation Guidelines" on page 25 to ensure that you work safely.
• Power off the server and disconnect all power cords for this task.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.
• Do not touch the processor contacts. Contaminants on the processor contacts, such as oil from your skin,
can cause connection failures.
• Do not allow the thermal grease on the processor or heat sink to come in contact with anything. Contact
with any surface can compromise the thermal grease, rendering it ineffective. Thermal grease can damage
components, such as the electrical connectors in the processor socket.
Note: The heat sink, processor, and processor carrier for your system might be different than those shown
in the illustrations.
Procedure
Step 1. Separate the processor from the heat sink and carrier.
Figure 66. Separating a processor from the heat sink and carrier
Note: Do not touch the contacts on the processor.
a. Lift the handle to release the processor from the carrier.
102
HR650X V2 User Guide