Soldering - Epson PX-8 Technical Manual

REV.-A
Table 6-3 Special Jigs
Name Standard
O'ty
Use
Commercial-
Iyavailable
*Extension cable (16-pin)
B778400701 1 Between MAPLE board and LCD
NO
unit
*Extension cable (20-pin)
B778400601 1 Between MAPLE board and
NO
microcassette
*Extension cable (11-pin)
B778400801 1 Between MAPLE board and
NO
microcassette
Azimuth tape Olympus OA-211 1 Adjustment and inspection of
YES
B777600101 microcassette
P reel torque check cassette Sony TW-1112A 1 Adjustment and inspection of
YES
B777600201 m icrocassette
RS-232C MINI WRAP B778401101 1 NO
Serial MINI WRAP B778401001 1
Adjustment of azimuth NO
External speaker connector B778400201 1
Adjustment of azimuth NO
Key top puller B765000001 1 Key top removal YES
Microcassette tape (EPSON
Y202503000
1 Microcassette tape read/write
YES
C-30) test
Test program ROM B778401201 1 Repair NO
Table 6-4 Oil, Grease, and Chemicals
Name Standard
O'ty Use
Commercial-
Iyavailable
Flux remover
--
1
YES
Instantaneous cooling agent
--
1 SOLDERING
YES
Alcohol
- -
YES
Silicon lock
- -
6.3 Soldering
Inaduertant soldering of delicate component can cause component damage. Carefully read and
fllow the reccauting in Section 6.2.1 for component removal and soldering to safeguard the Maple
computer's circuitry.
6.3.1 Removing and Installing Parts
(1) When removing parts such as IC's, transistors, etc. from the board, cut the lead wires of the
parts with nippers and remove the solder. Melt the solder rapidly to prevent the parts from ab-
sorbing the heat.
(2) Solder each part quickly and use cooling agents to cool the part (to protect the parts and print-
ed circuit board).
(3) When removing parts, remove the solder from the holes using SOLDER REMOVER; pull out
the lead wires, which were cut in advance. This should be done without excessive use of force
in order to protect the land and print pattern from being removed.
6-3