Floor Clearance; Use Of The Rear Door Heat Exchanger - IBM x3850 X6 Planning And Implementation Manual

Shipping requirements for X6
The Full-length I/O Book cannot be shipped while installed in the x3850 X6 or x3950 X6
server. This I/O Book and its adapters must be shipped separately from the server.

4.3 Floor clearance

The server is a traditional rack design and it is installed to the rack rails from the front of the
rack. Sufficient space to lift and mount the server will be required. See the x3850 X6
Installation and Service Guide for information about racking.
When the server is mounted in a rack, it will be on non-sliding rails, fixed to the rack. There is
no need for additional floor clearance to pull the server out of the rack for maintenance or
upgrades. This is because all of the servers serviceable and upgradable components can be
accessed either from the front or from the rear of the server.
Having components that are accessed from the front or rear without sliding the server is
beneficial for a number of reasons:
The modular design makes the system easier to service as you only need to pull the
affected subsystem without having to pull the entire server out from the rack.
As there is no requirement to slide the server in and out of the rack, there are no cable
management arms to worry about.
The system is easier to install as you can unload all pluggable parts for lower weight when
lifting in to the rack.
The system is easier to upgrade from 2S to 4S by simply adding additional Compute
Books.
The system is easier to add additional I/O by hot-swapping and hot-adding an I/O Book to
add more adapters or simply by adding an additional I/O Book to the server.
The system is easier to add additional memory by pulling out the appropriate Compute
Book, adding the memory, then reinserting the Compute Book.
After the server is installed in the rack, the only floor clearance you will need will be for pulling
out and/or installing pluggable components such as the Compute Book, Storage Book, I/O
Books, or power supplies.

4.4 Use of the Rear Door Heat eXchanger

There is a Rear Door Heat eXchanger (RDHX) available for the IBM 42U 1100 mm Enterprise
V2 Dynamic Racks.
The RDHX has the following features:
It attaches in place of the perforated rear door and adds 10mm, making the overall
package 1200mm, which is the depth of two standard data center floor tiles.
The doors use 3/4 inch quick connect couplers, which include automatic valves which
restrict water leakage, typically a few drops at most, when connecting or disconnecting the
doors.
Each door has a capacity of 9 liters (2.4 US gallons), and supports flow rates of 22.7 liters
(6 US gallons) to 56.8 liters (15 US gallons) per minute.
Chapter 4. Infrastructure planning
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