Sony HAP-S1 Service Manual page 45

THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
For Printed Wiring Boards.
Note:
• X : Parts extracted from the component side.
• Y : Parts extracted from the conductor side.
• : Internal component.
f
• : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen
(Conductor Side) from the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Component Side) the parts face are indicated.
Caution:
Pattern face side: Parts on the pattern face side seen
(SIDE B) from the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(SIDE A) the parts face are indicated.
• FPGA DSP and MAIN boards are multi-layer printed
board. However, the patterns of intermediate layers have
not been included in diagrams.
• Indication of transistor.
C
Q
These are omitted.
B E
• Lead layouts
Lead layout of conventional IC CSP (Chip Size Package)
• Abbreviation
CND : Canadian model
Note 1: When the complete MAIN board is replaced, refer to
"NOTE OF REPLACING THE COMPLETE MAIN
BOARD" and "CHECKING METHOD OF NET-
WORK CONNECTION" on page 5.
Note 2: When the complete AMP board is replaced, refer to
"NOTE OF REPLACING THE D218, IC350 AND
IC351 ON THE AMP BOARD AND THE COM-
PLETE AMP BOARD" on page 4.
HAP-S1
For Schematic Diagrams.
Note:
• All capacitors are in μF unless otherwise noted. (p: pF) 50
WV or less are not indicated except for electrolytics and
tantalums.
• All resistors are in Ω and 1/4 W or less unless otherwise
specifi ed.
• : Internal component.
f
• 2 : Nonfl ammable resistor.
• C : Panel designation.
Note: Note:
The components identi- Les composants identifi és
fi ed by mark 0 or dotted par une marque 0 sont
line with mark 0 are criti- critiques pour la sécurité.
cal for safety. Ne les remplacer que par
Replace only with part une pièce portant le nu-
number specifi ed. méro spécifi é.
• A : B+ Line.
• B : B– Line.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : POWER ON
• Voltages are taken with VOM (Input impedance 10 M).
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
: AUDIO (ANALOG)
F
surface
: AUDIO (DIGITAL)
J
L : AUDIO IN (ANALOG)
: AUDIO IN (DIGITAL)
c
: HDD
f
N : USB
d : LAN
: WIRELESS LAN
G
E : VIDEO
• The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
from that of conventional IC.
• Abbreviation
CND : Canadian model
Note 1: When the complete MAIN board is replaced, refer to
"NOTE OF REPLACING THE COMPLETE MAIN
BOARD" and "CHECKING METHOD OF NET-
WORK CONNECTION" on page 5.
Note 2: When the complete AMP board is replaced, refer to
"NOTE OF REPLACING THE D218, IC350 AND
IC351 ON THE AMP BOARD AND THE COM-
PLETE AMP BOARD" on page 4.
• Circuit Boards Location
MAIN board
ALLEGRO-ANT-L board
POWER KEY board
HP board
ALLEGRO-LCD board
FPGA DSP board
45 45
WLAN/BT COMBO card
(WBC1)
STANBY board
SPTM board
DCDC board
PENC board
AMP board
KEY JOG board
ALLEGRO-ANT-L board
U-COM board
HAP-S1
DIGITAL IO board
DAC board