Servicing Notes - Sony HAP-S1 Service Manual

HAP-S1
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
ABOUT THE ALLEGRO-ANT-L BOARD AND ALLEGRO-
ANT-R BOARD
ALLEGRO-ANT-L and ALLEGRO-ANT-R boards are not cov-
ered in the servicing.
NOTE OF REPLACING THE IC101, IC301, IC302,
IC501 AND IC602 ON THE MAIN BOARD
IC101, IC301, IC302, IC501 and IC602 on the MAIN board cannot
exchange with single. When these parts are damaged, exchange the
complete mounted board.
NOTE OF REPLACING THE IC001 AND IC702 ON
THE FPGA DSP BOARD
IC001 and IC702 on the FPGA DSP board cannot exchange with
single. When these parts are damaged, exchange the complete
mounted board.
DESTINATION IDENTIFICATION
Distinguish by Part No. on the rear side of a main unit.
– Rear Panel –
Destination
US and Canadian models
AEP and UK models
4
SECTION 1

SERVICING NOTES

PART No.
Part No.
4-464-753-1[]
4-464-753-2[]
NOTE OF REPLACING THE D218, IC350 AND IC351
ON THE AMP BOARD AND THE COMPLETE AMP
BOARD
When D218, IC350 and IC351 on the AMP board and the complete
AMP board are replaced, it is necessary to spread the compound
between these parts and the heat sink.
Spread the compound (TB2955Q) referring to the fi gure below.
– AMP Board (Component Side) –
D218
NOTE OF REPLACING THE HARD DISK DRIVE (Ref.
No. HDD1)
When the hard disk drive (Ref. No. HDD1) is replaced, be sure
to carry out the "Factory Reset" according to the following pro-
cedure.
Resetting to the factory default (Factory Reset)
You can reset the HDD AUDIO PLAYER to the factory default settings. All settings you have
configured and all of the content stored on the internal hard disk drive will be deleted. (Sample
tracks saved on the internal hard disk drive by default remain.)
1. Select [Settings] - [System Settings] in the Home screen.
2. Select [Factory Reset].
3. Select [Yes].
The Factory Reset waiting screen appears.
4. When the Factory Reset complete screen appears, select [OK].
When the Factory Reset is complete, the HDD AUDIO PLAYER restarts automatically.
Note
If you perform the Factory Reset function while playing tracks, playback of the music files
stops.
If you perform the Factory Reset function while transferring music files, transfer of the music
files stops.
If you want to re-transfer music files that were transferred to the HDD AUDIO PLAYER before
you performed the Factory Reset function, select the backup folder and check "Watch" in the
Contents Settings window of HAP Music Transfer. Go to the Transfer Settings window and
select [Clear] for [Transferred Files List] to delete the transfer history, and then
automatically or manually transfer the files.
IC351 IC350