Thermal Considerations; Cpu Die Temperature; Model Differences - VersaLogic Copperhead VL-EBX-41 Reference Manual

Thermal Considerations

CPU D T
IE EMPERATURE
The CPU die temperature is affected by numerous conditions, such as CPU utilization, CPU
speed, ambient air temperature, air flow, thermal effects of adjacent circuit boards, external heat
sources, and many others.
The CPU is protected from over-temperature conditions by several mechanisms, including
Minimum Frequency Mode (MFM), coreclock modulation, and THERMTRIP#.
See the 3rd Generation Intel® Embedded Mobile Processor Datasheet, Vol. 1
information on CPU thermal considerations.
As a failsafe, if the CPU die temperature climbs above +105°C, the CPU will turn itself off to
prevent damage to the chip. Note that Intel does not warrant their CPUs in the event of this
occurrence.
M D
ODEL IFFERENCES
VersaLogic offers both commercial and industrial temperature models of the VL-EBX-41. The
basic operating temperature specification for Copperhead models is shown below.
Thermal Solution
Heat plate
Heat sink (fanless)
Fan + heat sink
For heat plate only models, the customer-provided thermal solution must keep the heat plate
below 90°C, measured top dead center of the heat plate. For example, for an 85°C ambient
temperature, the thermal solution needs to:

Dissipate 45W with a 5°C delta between ambient and the heat plate

Thermal resistance = 0.11°C / W for the 45W unit
See Figure 6 for heat plate dimensions and mounting holes.
EBX-41 Reference Manual
Temp. Range
0°C to +60°C
-40°C to +85°C
(0.5 Linear Meters per Second)
0°C to +60°C
(0.5 Linear Meters per Second)
-40°C to +85°C
(0.5 Linear Meters per Second)
for complete
Airflow
Zero airflow
125 Linear Feet per Minute
125 Linear Feet per Minute
125 Linear Feet per Minute
Introduction
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