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Intel E7000 Series manual available for free PDF download: Design Manual
Intel E7000 Series Design Manual (128 pages)
Thermal and Mechanical Design Guidelines
Brand:
Intel
| Category:
Computer Hardware
| Size: 3.46 MB
Table of Contents
Table of Contents
3
1 Introduction
11
Document Goals and Scope
11
Importance of Thermal Management
11
Document Goals
11
Document Scope
12
References
13
Definition of Terms
13
2 Processor Thermal/Mechanical Information
15
Mechanical Requirements
15
Processor Package
15
Figure 2-1. Package IHS Load Areas
15
Heatsink Attach
17
General Guidelines
17
Heatsink Clip Load Requirement
17
Additional Guidelines
18
Thermal Requirements
18
Processor Case Temperature
18
Thermal Profile
19
Thermal Solution Design Requirements
19
Figure 2-2. Processor Case Temperature Measurement Location
19
Figure 2-3. Example Thermal Profile
20
Heatsink Design Considerations
21
Tcontrol
21
Heatsink Size
22
Heatsink Mass
22
Package IHS Flatness
23
Thermal Interface Material
23
System Thermal Solution Considerations
24
Chassis Thermal Design Capabilities
24
Improving Chassis Thermal Performance
24
Table 2-1. Heatsink Inlet Temperature of Intel Reference Thermal Solutions
24
Table 2-2. Heatsink Inlet Temperature of Intel Boxed Processor Thermal Solutions
24
Summary
25
System Integration Considerations
25
3 Thermal Metrology
27
Characterizing Cooling Performance Requirements
27
Example
28
Figure 3-1. Processor Thermal Characterization Parameter Relationships
28
Processor Thermal Solution Performance Assessment
29
Local Ambient Temperature Measurement Guidelines
29
Figure 3-2. Locations for Measuring Local Ambient Temperature, Active ATX
31
Figure 3-3. Locations for Measuring Local Ambient Temperature, Passive Heatsink
31
Processor Case Temperature Measurement Guidelines
32
4 Thermal Management Logic and Thermal Monitor Feature
33
Processor Power Dissipation
33
Thermal Monitor Implementation
33
PROCHOT# Signal
34
Thermal Control Circuit
34
Thermal Monitor
34
Thermal Monitor 2
35
Figure 4-1. Thermal Monitor Control
35
Operation and Configuration
36
Figure 4-2. Thermal Monitor 2 Frequency and Voltage Ordering
36
On-Demand Mode
37
System Considerations
37
Operating System and Application Software Considerations
38
THERMTRIP# Signal
38
Cooling System Failure Warning
38
Digital Thermal Sensor
38
Platform Environmental Control Interface (PECI)
39
5 Balanced Technology Extended (BTX) Thermal/Mechanical Design Information
41
Overview of the BTX Reference Design
41
Target Heatsink Performance
41
Table 5-1. Balanced Technology Extended (BTX) Type II Reference TMA Performance
41
Acoustics
42
Table 5-2. Acoustic Targets
42
Effective Fan Curve
43
Voltage Regulator Thermal Management
44
Figure 5-1. Effective TMA Fan Curves with Reference Extrusion
44
Table 5-3. VR Airflow Requirements
44
Altitude
45
Reference Heatsink Thermal Validation
45
Environmental Reliability Testing
45
Structural Reliability Testing
45
Random Vibration Test Procedure
45
Shock Test Procedure
46
Figure 5-2. Random Vibration PSD
46
Figure 5-3. Shock Acceleration Curve
46
Power Cycling
47
Recommended Test Sequence
47
Recommended Bios/Cpu/Memory Test Procedures
48
Material and Recycling Requirements
48
Safety Requirements
49
Geometric Envelope for Intel Reference BTX Thermal Module Assembly
49
Figure 5-4. Intel Type II TMA 65W Reference Design
49
Preload and TMA Stiffness
50
Structural Design Strategy
50
TMA Preload Verse Stiffness
50
Figure 5-5. Upward Board Deflection During Shock
50
Figure 5-6. Minimum Required Processor Preload to Thermal Module Assembly
51
Stiffness
51
Table 5-4. Processor Preload Limits
51
Figure 5-7. Thermal Module Attach Pointes and Duct-To-SRM Interface Features
52
6 ATX Thermal/Mechanical Design Information
53
ATX Reference Design Requirements
53
Figure 6-1. E18764-001 Reference Design - Exploded View
54
Figure 6-2. Bottom View of Copper Core Applied by TC-1996 Grease
54
Validation Results for Reference Design
55
Heatsink Performance
55
Table 6-1. E18764-001 Reference Heatsink Performance
55
Acoustics
56
Altitude
56
Table 6-2. Acoustic Results for ATX Reference Heatsink (E18764-001)
56
Heatsink Thermal Validation
57
Environmental Reliability Testing
57
Structural Reliability Testing
57
Random Vibration Test Procedure
57
Shock Test Procedure
58
Figure 6-3. Random Vibration PSD
58
Figure 6-4. Shock Acceleration Curve
58
Power Cycling
59
Recommended Bios/Cpu/Memory Test Procedures
60
Material and Recycling Requirements
60
Safety Requirements
61
Geometric Envelope for Intel Reference ATX Thermal Mechanical Design
61
Reference Attach Mechanism
62
Structural Design Strategy
62
Figure 6-5. Upward Board Deflection During Shock
62
Mechanical Interface to the Reference Attach Mechanism
63
Figure 6-6. Reference Clip/Heatsink Assembly
63
Figure 6-7. Critical Parameters for Interfacing to Reference Clip
64
Figure 6-8. Critical Core Dimension
64
7 Intel Quiet System Technology (Intel QST)
65
Intel ® QST Algorithm
65
Output Weighting Matrix
66
Proportional-Integral-Derivative (PID)
66
Figure 7-1. Intel ® QST Overview
66
Figure 7-2. PID Controller Fundamentals
67
Board and System Implementation of Intel
68
Qst
68
Figure 7-3. Intel ® QST Platform Requirements
68
Figure 7-4. Example Acoustic Fan Speed Control Implementation
69
Intel QST Configuration & Tuning
70
Fan Hub Thermistor and Intel
70
Qst
70
Figure 7-5. Digital Thermal Sensor and Thermistor
70
Appendix Alga775 Socket Heatsink Loading
71
LGA775 Socket Heatsink Considerations
71
Metric for Heatsink Preload for Atx/Uatx Designs Non-Compliant with Intel Reference Design
71
Heatsink Preload Requirement Limitations
71
Motherboard Deflection Metric Definition
72
Table 7-1. Board Deflection Configuration Definitions
72
A.3.1
72
Board Deflection Limits
73
Figure 7-6. Board Deflection Definition
73
A.3.2
73
Board Deflection Metric Implementation Example
74
Additional Considerations
75
A.3.4
75
Figure 7-7. Example: Defining Heatsink Preload Meeting Board Deflection Limit
75
Motherboard Stiffening Considerations
76
Heatsink Selection Guidelines
76
Appendix B Heatsink Clip Load Metrology
77
Overview
77
Test Preparation
77
Heatsink Preparation
77
B.1 Overview
77
B.2 Test Preparation
77
B.2.1
77
Figure 7-8. Load Cell Installation in Machined Heatsink Base Pocket - Bottom View
78
Figure 7-9. Load Cell Installation in Machined Heatsink Base Pocket - Side View
79
Figure 7-10. Preload Test Configuration
79
Typical Test Equipment
80
Test Procedure Examples
80
Table 7-2. Typical Test Equipment
80
Preload Degradation under Bake Conditions
81
B.3.1
81
B.3.2
81
Time-Zero, Room Temperature Preload Measurement
81
Appendix C Thermal Interface Management
83
Bond Line Management
83
Interface Material Area
83
Interface Material Performance
83
Case Temperature Reference Metrology
85
Appendix D Case Temperature Reference Metrology
85
Objective and Scope
85
Supporting Test Equipment
85
Figure 7-11. Omega Thermocouple
86
Thermal Calibration and Controls
87
IHS Groove
87
D.4 IHS Groove
87
Figure 7-12. 775-LAND LGA Package Reference Groove Drawing at 6 O'clock Exit
88
Figure 7-14. IHS Groove at 6 O'clock Exit on the 775-LAND LGA Package
90
Figure 7-15. IHS Groove at 6 O'clock Exit Orientation Relative to the
90
Thermocouple Attach Procedure
91
Thermocouple Conditioning and Preparation
91
Figure 7-16. Inspection of Insulation on Thermocouple
91
D.5.1
91
Thermocouple Attachment to the IHS
92
Figure 7-17. Bending the Tip of the Thermocouple
92
Figure 7-18. Securing Thermocouple Wires with Kapton* Tape Prior to Attach
92
Figure 7-19. Thermocouple Bead Placement
93
Figure 7-20. Position Bead on the Groove Step
94
Figure 7-21. Detailed Thermocouple Bead Placement
94
Figure 7-22. Third Tape Installation
94
Figure 7-23. Measuring Resistance between Thermocouple and IHS
95
D.5.1
95
Figure 7-24. Applying Flux to the Thermocouple Bead
96
Figure 7-25. Cutting Solder
96
Solder Process
97
D.5.1
97
D.5.3
97
Figure 7-26. Positioning Solder on IHS
97
Figure 7-27. Solder Station Setup
98
Figure 7-28. View through Lens at Solder Station
99
Figure 7-29. Moving Solder Back Onto Thermocouple Bead
99
Cleaning & Completion of Thermocouple Installation
100
Figure 7-30. Removing Excess Solder
100
Figure 7-31. Thermocouple Placed into Groove
101
Figure 7-32. Removing Excess Solder
101
Figure 7-33. Filling Groove with Adhesive
102
Figure 7-34. Application of Accelerant
102
Figure 7-35. Removing Excess Adhesive from IHS
103
Figure 7-36. Finished Thermocouple Installation
103
Thermocouple Wire Management
104
Figure 7-37. Thermocouple Wire Management
104
Appendix E Balanced Technology Extended (BTX) System Thermal Considerations
105
Figure 7-38. System Airflow Illustration with System Monitor Point Area Identified
106
Figure 7-39. Thermal Sensor Location Illustration
107
Appendix F Fan Performance for Reference Design
109
Table 7-3. Fan Electrical Performance Requirements
109
Figure 7-41. Atx/Μatx Motherboard Keep-Out Footprint Definition and Height
111
Figure 7-42. Atx/Μatx Motherboard Keep-Out Footprint Definition and Height
111
Figure 7-54. Intel ® E18764-001 Reference Solution Assembly
111
Intel Enabled Reference Solution Information
127
Table 7-4. Intel ® Representative Contact for Licensing Information of BTX Reference Design
127
Table 7-5. E18764-001 Reference Thermal Solution Providers
127
Table 7-6. BTX Reference Thermal Solution Providers
128
Appendix G Mechanical Drawings
111
Figure 7-40. Atx/Μatx Motherboard Keep-Out Footprint Definition and Height
111
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