Power Specifications Summary; Table 4. Physical Dimensions Of Hardware Components; Table 5. Power Budget Of Hardware Components; Table 6. Power And Heat Dissipation Specifications Of Chassis - Intel MFSYS25V2 Specification

Intel® Modular Server System TPS

Table 4. Physical Dimensions of Hardware Components

Module
Chassis
Compute module
CMM
I/O
Storage
Hard drive bay
Power supply
module
Main cooling module
I/O cooling module
3.1.3

Power Specifications Summary

The following table provides a summary of the 12V power budget for all modules in the Intel
Modular Server System MFSYS25/MFSYS35 .
The following table provides a summary of the power and heat dissipation specifications for the
®
Intel Modular Server System MFSYS25/MFSYS35.

Table 6. Power and Heat Dissipation Specifications of Chassis

Power Supply Input
Power Supply Output
System Power Input
System Power Output
System Power
System Heat Dissipation
System Heat Dissipation
Revision 1.7
Height
261.4 mm
41.7 mm
25.0 mm
38.0 mm
32.0 mm
182.5 mm
53.3 mm
126.6 mm
49.4 mm

Table 5. Power Budget of Hardware Components

Subsystem
Compute module
Mezzanine card
Chassis management module
Chassis management module 2
I/O Switch
Storage module
2.5/3.5-inch SAS drives
Chassis
Power supply blank
Intel order number E15155-010
Width
444.4 mm
279.4 mm
167.6 mm
167.6 mm
167.6 mm
130.2 mm
115 mm
126.0 mm
132.6 mm
12V Budget
406 W
5 W
5 W
24 W
40 W
48 W
140 W
188 W
26 W
1240 W
1050 W
3720 W
3150 W
100 V – 127 V, 200 V – 240 V
3720 W (12,701 BTUH) maximum
428 W (1461 BTUH) minimum
System Details
Length
720.2 mm
420.3 mm
295.9 mm
295.9 mm
295.9 mm
419.1 mm
286.3 mm
291.9 mm
416.9 mm
®
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