Revision History - Intel MFSYS25V2 Specification

Technical product specification
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Rivision History
Date
Revision
Number
July, 2007
0.88
September, 2007
1.0
February, 2008
1.1
June, 2008
1.2
November, 2008
1.3
June, 2009
1.4
May, 2010
1.5
December, 2010
1.6
March, 2011
1.7
Information in this document is provided in connection with Intel
estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's
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express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to
fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property
right. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make
changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" inches or
"undefined" Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or
incompatibilities arising from future changes to them.
®
The Intel
Modular Server System may contain design defects or errors known as errata, which may cause the
product to deviate from published specifications. Current characterized errata are available on request.
Intel Corporation server baseboards contain a number of high-density VLSI and power delivery components that need
adequate airflow to cool. Intel's own chassis are designed and tested to meet the intended thermal requirements of
these components when the fully integrated system is used together. It is the responsibility of the system integrator
that chooses not to use Intel developed server building blocks to consult vendor datasheets and operating parameters
to determine the amount of airflow required for their specific application and environmental conditions. Intel
Corporation cannot be held responsible if components fail or the server board does not operate correctly when used
outside any of their published operating or non-operating limits.
Intel and Xeon are trademarks or registered trademarks of Intel Corporation.
*Other brands and names may be claimed as the property of others. Copyright © Intel Corporation 2007-2011
ii

Revision History

Initial release.
Updated the document.
Updated the document.
Updated Power Budget of Hardware Components, Table 5. Added 3.5-inch drive
bay information for the Intel
Updated System Details, power and heat specifications.
Updated the document.
Removed CCC and CNCA.
Added MFSYS25V2 info.
Added CMM2 power compensation info.
Disclaimers
Intel order number E15155-010
Intel® Modular Server System TPS
Modifications
®
Modular Server System MFSYS35.
®
products. No license, express or implied, by
Revision 1.7

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