Compute Module; Storage Enclosure; I/O Cooling Module - Intel MFSYS25V2 Specification

System Overview
2.2.1

Compute Module

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The Intel Modular Server System MFSYS25/MFSYS35 supports up to six compute modules.
Each of these general-purpose servers provides the following minimum features:
Processor(s)
Memory
Integrated Baseboard management controller
Network interface
Each server connects to the chassis management module, storage controllers and switch
modules through the midplane board. The midplane also distributes the 12V power from the
power supplies to the compute modules. The servers connect to the shared storage (14 SAS
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drives in the Intel
Modular Server System MFSYS35) through the storage controller(s) in the rear of the chassis.
See the individual Intel
information about your compute module(s).
2.2.2

Storage Enclosure

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The Intel Modular Server System MFSYS25/MFSYS35 supports an optional hard disk drive
storage enclosure and has the following minimum features:
Bays for 14 hot-swap 2.5-inch SAS hard disk drives in the Intel
MFSYS25 and six (6) 3.5-inch SAS/SATA hard drives in the Intel
System MFSYS35
At least one storage controller in an I/O slot
Because hard disk drives have different cooling, power, and vibration characteristics, Intel
validates specific hard disk drive types in the platforms. See the Intel
Tested Hardware and Operating System List for a list of qualified drives.
2.2.3

I/O Cooling Module

The I/O cooling module consists of six fans that operate in a (3 + 3) cooling redundancy in a
hot-swap module with power and failure indicators. These fans provide cooling for all I/O
modules. This module is accessible from the front of the system even though it cools the I/O
modules in the rear of the system.
6
Modular Server System MFSYS25 and six SAS/SATA drives in the Intel
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Compute Module Technical Product Specification for model-specific
Intel order number E15155-010
Intel® Modular Server System TPS
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Modular Server System
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Modular Server
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Modular Server System
Revision 1.7
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