Esd Layout - Realtek RTL8762C Hardware Instructions

Error:
Parallel traces at layer1
and layer2.
Correct:
Fine tune the trace to
make them
parallel at
nearby layers.

External Flash must be placed as close as possible to IC.
No copper between IC Pin PAD and EP PAD, and GND PAD must be directly connected
to GND layer
Correct

13.8 ESD Layout

In order to protect IC from ESD, the following items should be noted in the PCB design:

ESD protection tubes (TVS usually) should be added for sensitive devices and sensitive
signal traces. TVS should be placed as close as possible to the ESD source (connector, etc.)
not in
the two
EP PAD should be connected to GND layer by GND Via
RTL8762C Evaluation Board User Manual
NG
31