Correct
The ground via of the RF components should be as close to the soldering pad as possible.
GND Via should be connected to the GND layer directly instead of TOP layer. The copper
grounding should be covered.
NG
For
the
RF
matching
components,
GND
connects to the TOP layer
Correct
For the RF matching components,
GND Via should be connected to
the GND layer directly, instead of
TOP layer
The copper is
not completely
divided by trace
via
RTL8762C Evaluation Board User Manual
NG
29
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