Processor And Chipset Support - Supermicro X13DDW-A User Manual

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Super X13DDW-A User's Manual

1.2 Processor and Chipset Support

Built upon the functionality and capability of 4th and 5th Gen Intel Xeon Scalable Processors
(Socket-E) and the Intel C741 chipset, the X13DDW-A motherboard offers critical, pivotal
technological breakthroughs that unleash unprecedented computing capabilities and provides
a scalable platform optimized for applications used in Artificial Intelligence (AI) Acceleration,
Deep Learning Boost, Network Interconnectivity, and Platform Manageability technologies.
The key features supported by the platform include the following:
Processor Features Supported
Increased, scalable performance with substantial advancements, including UPI speed
improvement, memory speed/capacity/utilization enhancement, hardware-based security
innovations for virtualization, and platform interconnectivity optimization
Integrated accelerators optimized for workload enhancement including Advanced Matrix
Extensions (IntelAMX), In-Memory Analytic Accelerator (IAX), and Data Streaming Accel-
erator (IntelDSA).
Breakthroughs in memory and I/O support, including DDR5 (4800 MT/s max.), PCIe 5.0
(80 lanes max.), and CXL 1.1 (4 devices per CPU)
Increased operational and performance efficiency with substantial enhancements in virtu-
alization, network security, and telemetry and power management
Integrated AI accelerators with support of 3rd Gen Intel
Tile Matrix Multiply (AMX/MUL)
Enhanced Intel
Security Boost Software Guard Extensions with Integrity Platform Firmware
®
Resilience support
Intel
Ultra Path Interconnect (Intel
®
New Computer Express Link (CXL) and Intel
CPU with 52 physical address/57 virtual address support
Intel
Trusted Domain Extensions (TDX) support (5th Gen Xeon Scalable processors only)
®
PCH Features Supported
Flexible IO at 20 lanes for PCIe 3.0, 1G Ethernet in PCH for manageability, and four DMIs
at PCIe 3.0
®
UPI) up to 4 links per processor at 20GT/s
®
Speed Select Technology
®
18
Deep Learning Boost and new

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