Supermicro X13DDW-A User Manual page 15

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Motherboard Features
CPU
Supports dual 4th and 5th Gen Intel Xeon Scalable Processors (Socket-E LGA 4677) with four UPIs (20GT/s max.) and
a thermal design power (TDP) of up to 350W
Note: SP XCC and SP MCC SKUs are supported.
Memory
Supports up to 4TB 3DS RDIMM/RDIMM DDR5 (288-pin) ECC memory
Memory speeds of up to 4800 MT/s (DDR5-4400 MT/s when fully populated) in 16 memory slots (4th Generation Intel Xeon)
Memory speeds of up to 5600 MT/s (DDR5-4400 MT/s when fully populated) in 16 memory slots (5th Generation Intel Xeon)
Note: Memory speed and capacity support depends on the processors used in the system.
DIMM Size
Up to 256GB
Note: For the latest CPU/memory updates, please refer to our website at
motherboard.
Chipset
Intel PCH C741
Expansion Slots
Six PCIe 5.0 x16 riser cards supported
Two NVMe M.2 ports from CPU1 (with M-Key 2280 support)
Flexible Advanced I/O Module (AIOM) for (OCP 3.0 compatible) cards for Ethernet connections
Two AIOM (OCP 3.0 compatible) x16 slots
Two USB 3.0 rear I/O connectors
Four MCIO 5.0 x8 and eight MCIO 5.0 x4 connectors for 12 NVMe device support (*Note below)
12 SATA 3.0 connections supported (RAID 0, 1, 5, 10)
One TPM (Trusted Platform Module) slot
Note: This motherboard supports eight x4, four x8 MCIO NVMe connections, and it also supports up to 12 NVMe
slots if an S12 (12 x 3.5") backplane is used.
Baseboard Management Controller (BMC)/Network
ASPEED AST2600 BMC
One dedicated BMC LAN/VGA (via AST2600)
Graphics
Graphics controller & VGA support via ASPEED AST2600 BMC
I/O Devices
One VGA connector (JVGA1) for VGA/video display on the rear I/O panel
Flexible AIOM (OCP 3.0 compatible) card for Ethernet connection support
Peripheral Devices
One dedicated USB 3.0 connector via BMC for two USB 3.0 connections (USB 2/3) on the rear I/O panel
One USB 2.0 header (J35) with support of two USB 2.0 ports (USB 0/1) for front access
Motherboard Features
15
Chapter 1: Introduction
http://www.supermicro.com/products/

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