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SECTION II
Model 4277A
2-21., Installation of Options 907, 908 and 909.
2-22. The 4277A can be installed in a rack and
be operated as a component of a measurement
system.
Rack
mounting information for the
4277A is presented in Figure 2-3.
2-23. STORAGE AND SHIPMENT
2-24. ENVIRONMENT
2-25. The instrument may be stored or shipped
in environments within the following limits:
Temperature . -40°Cto+70®C
Humidity. to 95% at 40 ® C
The
instrument
must
be
protected
from
temperature extremes which cause condensation
inside the instrument.
2-26. PACKAGING
2-27. Original
Packaging.
Containers
and
materials identical to those used in factory
packaging are available from Hewlett-Packard.
If
the
instrument
is
being
returned
to
Hewlett-Packard
for
servicing, attach a tag
indicating the type of service required, return
address, model number, and full serial number.
Also mark the container FRAGILE to assure
careful handling.
In any correspondence, refer
to the instrument by model number and full
serial number.
2-28. Other Packaging.
The following general
instructions should be used for re-packing with
commercially available, materials:
a.
Wrap
instrument
in
heavy
paper
or
plastic.
If shipping to Hewlett-Packard
office
or
service
center,
attach
tag
indicating type of service required, return
address, model number, and full serial
number.
b.
Use
strong
shipping
container.
A
double-wall carton made of 350 pound
test material is adequate.
e.
Use enough shock absorbing material (3 to
4
inch
layer)
around
all
sides
of
instrument to provide firm cushion and
prevent
movement
inside
container.
Protect control panel with cardboard.
d.
Seal shipping container securely.
e.
Mark
shipping
container
FRAGILE
to
ensure careful handling.
f.
In
any
correspondence,
refer
to
instrument by
model number
and
full
serial number.
2-29.
OPTION INSTALLATION
2-30.
Installation procedures for DC Bias option
(Option 001) and Comparator/Handler Interface
option (Option 002) are given in Figure 2-4.
2-31.
POWER
FAILURE
MONITOR
INSTALLATION
2-32.
To use the power failure monitor signal,
you must solder two wires to a jumper on the
mother board, remove a cap from a hole on the
rear panel, and bring the wires out through the
hole.
The
procedure
is
given
below.
A
simplified drawing of the open collector circuit,
a timing diagram, and the locations of the
jumper and hole are shown in Figure 2-6. Refer
to paragraph 2-114 for a description of the
power failure monitor signal.
Procedure:
1. Turn off the 4277A.
2. Disconnect the 4277A from the ac power
source.
3. Remove the top cover.
4. Disconnect the brown 4-terminal connector
from the A5 board.
5. Remove the two screws that secure the A5
board to the chassis.
6. Remove the A5 board.
7. Solder a wire to each terminal of A6J3.
The location of A6J3 is shown in Figure 2-6
(c).
8. Remove the cap from the access hole in
the rear panel, as shown in Figure 2-6 (d).
9. Thread the wires first through the teflon
clamp (securing the wires from A6J1) on
the A6 board, and then through the access
hole in the rear panel.
10. Reinstall the
A5
board,
reconnect
the
brown 4-terminal connector
to
the
A5
board, and replace the top cover.
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