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Appendix C: System Specifications
Appendix C
System Specifications
Processors
Dual Intel Xeon 81xx/61xx/51xx/41xx/31xx series or 82xx/62xx/52xx/42xx/32xx series processors (Socket P) processors with
three UltraPath Interconnects (UPIs) of up to 10.4 GT/s. Note: Both CPUs need to be installed for full access to the PCI-E
slots, DIMM slots, and onboard controllers.
Chipset
Intel Intel® C627 chipset
BIOS
256 Mb SPI AMI BIOS® SM Flash UEFI BIOS
Memory
Up to 6TB 3DS ECC RDIMM/LRDIMM to speeds of DDR4-2933MHz in 24 DIMM slots
(82xx/62xx/52xx/42xx/32xx series processors) Supports up to twelve Intel Optane DCPMMs.
Up to 3TB 3DS ECC RDIMM/LRDIMM to speeds of DDR4-2666MHz, in 24 DIMM slots
(81xx/61xx/51xx/41xx/31xx series processors).
SATA Controller
On-chip (Intel® C627) controller
Drive Bays
Up to 32 E1.S internal drive bays
Note: M.2 requires the use of a specialized M.2 NVMe drive tray (MCP-220-12106-0N).
PCI Expansion Slots
2 PCI-E x32 Tray cable connector interface (E1.S subsystem support)
1 PCI-E 3.0 (x16 + x16 or x16 + QAT) left riser card support
Motherboard
X11DSF-E; 17" (W) x 19.5" (L) (431.8-mm x 495.3-mm)
Chassis
SC121EF 1U Rackmount, (WxHxD) 17.2 x 1.7 x 30" (437 x 43 x 762-mm)
System Cooling
Up to eight (8) 4-cm counter-rotating PWM fans
Power Supply
Model: PWS-1K62A-1R
AC Input Voltages: 100-240 VAC
Rated Input Current: 6-3A
Rated Input Frequency: 50-60 Hz
Rated Output Power: 1600W
Rated Output Voltages: +5V (25A), +12V (33A), -12V (0.6A), +3.3V (25A), +5Vsb (3A)
Operating Environment
Operating Temperature: 10º to 35º C (50º to 95º F)
Non-operating Temperature: -40º to 70º C (-40º to 158º F))
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)
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