Cleanliness Requirements - Ruijie RG-SAP885-SP Hardware Installation And Reference Manual

Hardware Installation and Reference Guide
2.2.5

Cleanliness Requirements

Dust poses a major threat to the running of the device. Indoor dust falling on the device
may be adhered by static electricity, causing poor contact of metallic joints. Such
electrostatic adherence may occur more easily when the relative humidity is low, not only
affecting the service life of the device, but also causing communication faults. The
following table describes the requirements for the dust content and granularity in the
equipment room.
Table 2-1 Requirements for Dust
Dust
Dust particles (diameter ≤ 0.5
μm)
Dust particles (0.5 μm < diameter
≤ 1 μm)
Dust particles (1 μm < diameter ≤
3 μm)
Dust particles (3 μm < diameter ≤
5 μm)
Apart from dust, the salt, acid, and sulfide in the air in the equipment room must also
meet strict requirements. These harmful substances will accelerate metal corrosion and
component aging. Therefore, the equipment room should be properly protected against
the intrusion of harmful gases, such as sulfur dioxide, hydrogen sulfide, nitrogen
dioxide, and chlorine gas. The following table lists limit values for harmful gases.
Table 2-2 Requirements for Gases
Gas
Sulfur dioxide (SO
Hydrogen sulfide (H
Unit
Particles/m
Particles/m
Particles/m
Particles/m
Average (mg/m
) 0.2
2
S) 0.006
2
Content
≤ 1.4 x 10^7
3
≤ 7 x 10^5
3
≤ 2.4 x 10^5
3
≤ 1.3 x 10^5
3
)
3
17
Preparing for Installation
Maximum (mg/m
3
1.5
0.03
)