Motherboard Features - Supermicro B13SEG Owner's Manual

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Motherboard Features

CPU
Supports a 4th Generation Intel Xeon Scalable Processor in an LGA4677 socket with a thermal design power (TDP) of
up to 270 W on air cooling and 350 W on liquid cooling
Memory
Supports up to 2 TB of DDR5 ECC RDIMM/RDIMM 3DS memory with speeds of up to 4800 MT/s in eight memory slots
DIMM Size
Up to 256 GB
Chipset
Intel PCH C741
Expansion Slots
One PCIe 5.0 x16 mezzanine card connector
Four PCIe 5.0 x8 MCIO connectors
Two M.2 M-Key 2280 PCIe 5.0 x4 connectors
Baseboard Management Controller (BMC)
Aspeed AST2600
Network
One 25 GbE LAN to backplane by onboard Mellanox ConnectX-4 Lx EN
Super I/O
Aspeed AST2600
Graphics
Aspeed AST2600
Peripheral Devices
One internal USB 2.0/3.0 Type-A port
BIOS
256 Mb AMI BIOS® SPI Flash BIOS
ACPI, EFI GUI, Real Time Clock (RTC) Wakeup, SPI dual/quad speed support
Power Management
ACPI power management (supports S1 and S5)
Power button override mechanism
Power-on mode for AC power recovery
Note: The table above is continued on the next page.
Motherboard Features
13
Chapter 1: Introduction

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