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Hardware Installation and Reference Guide
In the high-temperature environment, the aging process of insulating materials will be accelerated, the
reliability of the device will be greatly reduced, and its service life will be seriously affected.
Note
The temperature and humidity of the working environment of the device are measured at 1.5 m above the floor
and 0.4 m in front of the device rack when there is no protective plate before and after the rack.
2.2.5
Cleanliness Requirements
Dust is a major hazard to device operating. Indoor dust falling on the device body will cause electrostatic
adsorption and poor contact of metal contacts. Especially when the indoor relative humidity is low, it is more
likely to cause electrostatic adsorption, which will not only affect the service life of the device, but also cause
communication failures. The dust content and granule size requirements in the equipment room are as follows:
Table 2-1
Dust requirements
Dust
Dust granule (diameter ≤ 0.5 um)
Dust granule (0.5 um < diameter ≤ 1
um)
Dust granule (1 um < diameter ≤ 3
um)
Dust granule (3 um < diameter ≤ 5
um)
In addition to dust, the equipment room must strictly meet the requirements on the salt, acid and sulfide contained
in the air. These harmful substances can accelerate metal corrosion and component aging. The equipment room
should prevent the intrusion of harmful gases (such as sulfur dioxide, hydrogen sulfide, nitrogen dioxide, and
chlorine), and the specific limits are as follows:
Table 2-2
Gas requirements
Gas
Sulfur dioxide
Hydrogen sulfide
Nitrogen dioxide
Ammonia gas
Chlorine
Unit
Number
of
granules/m³
Number
of
granules/m³
Number
of
granules/m³
Number
of
granules/m³
Average (mg/m³ )
0.2
0.006
0.04
0.05
0.01
13
Installation Preparation
Content
≤ 1.4 x 10^7
≤ 7 x 10^5
≤ 2.4 x 10^5
≤ 1.3 x 10^5
Maximum (mg/m³ )
1.5
0.03
0.15
0.15
0.3
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