Haying; Curing; Topsoil Moisture; Weather And Topography - MacDon R85 Operator's Manual

4.13 Haying

4.13.1 Curing

Curing crops quickly helps maintain the highest quality because for each day that hay lies on the ground, 5% of the
protein is lost.
Leaving the windrow as wide and fluffy as possible results in the quickest curing. Cured hay should be baled as
soon as possible.

4.13.2 Topsoil Moisture

Table 4.3 Topsoil Moisture Levels
Level
Wet
Damp
Dry
• On wet soil, the general rule of wide and thin does not apply. A narrower windrow will dry faster than hay left flat
on wet ground.
• When the ground is wetter than the hay, moisture from the soil is absorbed by the hay above it. Determine topsoil
moisture level before cutting. Use a moisture tester or estimate level.
• If ground is wet due to irrigation, wait until soil moisture drops below 45%.
• If ground is wet due to frequent rains, cut when weather allows and let the forage lie on wet ground until it dries
to the moisture level of the ground.
• Cut hay will dry only to the moisture level of the ground beneath it, so consider moving the windrow to drier ground.

4.13.3 Weather and Topography

• Cut as much hay as possible by midday when drying conditions are best.
• Fields sloping south get up to 100% more exposure to the sun's heat than do north sloping fields. If hay is baled
and chopped, consider baling the south facing fields and chopping those facing north.
• When relative humidity is high, the evaporation rate is low and hay dries slowly.
• If there is no wind, saturated air becomes trapped around the windrow. Raking or tedding will expose the hay to
fresh, less saturated air.
• Cut hay perpendicular to the direction of the prevailing winds if possible.

4.13.4 Windrow Characteristics

Producing windrows with the recommended characteristics will achieve the greatest results. Refer to
for instructions on adjusting the header.
the Header, page 73
147757
OPERATING THE HEADER
% Moisture
Over 45%
25–45%
Under 25%
94
Condition
Soil is muddy
Shows footprints
Surface is dusty
4 Operating
Revision B