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2
Installing the Probe
Soldering the BGA Probe
Order of Installation
The W2631/2/3/4 BGA probes need to be attached to the DRAM PCB footprint on the design to be
probed, and the desired DRAM is soldered to the top side of the probe. This attachment may occur in
any order:
•
•
Solder Temperature
The probe is design to tolerate lead-free soldering temperature profiles. However, it is always
recommended to apply the minimum temperature required and the minimum number of
heating/cooling cycles to reduce risk of any damage to the probe.
Recommended soldering guidelines:
1
2
Solder Composition
The probe is supplied without solder balls. Depending on the exact attachment order, either leaded
or lead-free solder may be preferred to attach the probe to the DUT. The design of the probe
supports either choice.
Soldering Recommendations
The flexible "wings" on the probe may need to be bent upwards before soldering to avoid mechanical
contact with components adjacent to the probe on the DUT. This will also ensure reliable connection
when connect to the logic analyzer cable adapters.
If the in-house expertise to attach the BGA probe and DRAM cannot be found, there are contract
manufacturers with this expertise who may be willing to perform the attachment for a fee. More
information on BGA soldering and rework techniques that may be useful in attaching the probe may
be found at:
20
first solder the probe to the DUT, and then solder the DRAM to the probe, or
first solder the DRAM to the probe, and then solder the DRAM+probe assembly to the DUT.
The maximum temperature that the BGA probe can withstand is 260
Bake out the boards and components to eliminate moisture entrapment. Normally bake for 24
°
hours at 125
C or to the component or board specification.
"http://www.circuitrework.com/guides/9-0.shtml"
Keysight W2630 Series DDR2 DRAM BGA Probes Installation Guide
°
C.
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