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Lattice Semiconductor
Figure 1. MachXO2-1200ZE Breakout Board, Top Side
MachXO2-1200ZE
PLD (U3)
Two 2x20
Header Landings
(J2, J4)
FTDI
USB to UART/FIFO
IC (U1)
Storage and Handling
Static electricity can shorten the lifespan of electronic components. Please observe these tips to prevent damage
that could occur from electro-static discharge:
• Use anti-static precautions such as operating on an anti-static mat and wearing an anti-static wrist-band.
• Store the evaluation board in the packaging provided.
• Touch a metal USB housing to equalize voltage potential between you and the board.
Software Requirements
You should install the following software before you begin developing new designs for the Breakout board:
®
• Lattice Diamond
design software
• FTDI Chip USB hardware drivers (installed as an option within the Diamond installation program)
MachXO2-1200ZE Device
This board features the MachXO2-1200ZE PLD which offers embedded Flash technology for instant-on, non-vola-
tile operation in a single chip. Numerous system functions are included, such as a PLL and 64Kbits of embedded
RAM plus hardened implementations of I
mance I/Os support numerous single-ended and differential standards including LVDS, and also source synchro-
LED Array (J4)
Prototype Array (J6)
JTAG Header
USB Mini-B
Landing (J1)
Socket (J7)
2
C, SPI, timer/counter, and user Flash memory. Flexible, high perfor-
MachXO2-1200ZE Breakout Board
Evaluation Kit User's Guide
4x15 60-Hole
Power/GND
Power LED
Test Points
(PWR_ON)
(TP1, TP2, TP3)
3
Two 2x20
Header Landings
(J3, J5)
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