Package Description (Tssop-28) - Texas Instruments Chipcon Products CC1000-RTB1 Manual

30. Package Description (TSSOP-28)

Note: The figure is an illustration only.
TSSOP 28 Min
Max
All dimensions in mm
Thin Shrink Small Outline Package (TSSOP)
D E1 E A
9.60 4.30
6.40
9.80 4.50 1.20
SWRS048A
A1 e B L
0.05 0.19 0.45
0.65
0.15 0.30 0.75
CC1000
α
Copl.
0°
0.10
8°
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