Thermal Resistance Characteristics For Vqfnp; Package - Texas Instruments CC1021 Manual

CC1021
SWRS045F – JANUARY 2006 – REVISED NOVEMBER 2018
4.12 Thermal Resistance Characteristics for VQFNP Package
NAME DESCRIPTION
R Junction-to-case (top)
θJC(top)
R Junction-to-board
θJB
R Junction-to-free air
θJA
Psi Junction-to-package top
JT
Psi Junction-to-board
JB
R Junction-to-case (bottom)
θJC(bottom)
(1) °C/W = degrees Celsius per watt.
(2) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [Rθ
JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
• JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
Power dissipation of 2 W and an ambient temperature of 70ºC is assumed.
14 Specifications
Not Recommended for New Designs NRND
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] value, which is based on a
JC
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(1) (2)
°C/W
16.2
6.9
30.7
0.2
6.9
1.0