Package Description (Qfn 20); Recommended Pcb Layout For Package (Qfn 20); Soldering Information - Texas Instruments CC2500 TK Manual

33 Package Description (QFN 20)

33.1

Recommended PCB Layout for Package (QFN 20)

Figure 30: Recommended PCB Layout for QFN 20 Package
Note: The figure is an illustration only and not to scale. There are five 10 mil diameter via holes
distributed symmetrically in the ground pad under the package. See also the CC2500EM
reference design [4].
33.2

Soldering Information

The recommendations for lead-free reflow in IPC/JEDE J-STD-020D should be followed.
SWRS040C
CC2500
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