Mechanical - Digi Connect Wi ME 9210 Hardware Reference Manual

Additional Design Recommendations
The following list provides additional design guidance with respect to thermal management in
applications with operating temperatures at the high end or beyond the specified standard ambient
temperature range.
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Mechanical

Providing air movement will improve heat dissipation.
The host PCB plays a large part in dissipating the heat generated by the module. A large
copper plane located under the Digi Connect Wi-ME 9210 and soldered to the module's
mounting tabs will improve the heat dissipation capabilities of the PCB.
If the design allows, added buried PCB planes will also improve heat dissipation. The
copper planes create a larger surface to spread the heat into the surrounding
environment.
Adding a thermal pad or thermal compound, such as Sil-Pad
products made by the Bergquest Company (www.bergquistcompany.com), between the
host PCB and the underside of the module will significantly increase the thermal
transfer between the module's enclosure and the host PCB. Limit the fill area to the
folded metal portion of the module's underside.
Dimensions
Length
Width
Height
Weight
Device/serial
interface connector
Digi Connect Wi-ME 9210
and Digi Connect ME 9210
1.445 in.
(36.703 mm)
0.75 in. (19.05 mm)
0.854 in. (21.69 mm)
.616oz.
17.463g
14-pin micro header (7-pin double
row) with .05-inch (1.27-mm)
pitch.
® ®
, Gap Pad or Gap Filler
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