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ConnectCore 6 Plus Hardware Reference Manual...
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Added Heatsink topic with maximum perpendicular pressure value. Trademarks and copyright Digi, Digi International, and the Digi logo are trademarks or registered trademarks in the United States and other countries worldwide. All other trademarks mentioned in this document are the property of their respective owners.
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Feedback To provide feedback on this document, email your comments to techcomm@digi.com Include the document title and part number (ConnectCore 6 Plus Hardware Reference Manual, 90002278 M) in the subject line of your email. ConnectCore 6 Plus Hardware Reference Manual...
Supported devices MCA pinout Shared I2C bus Shared SPI bus CryptoAuthentication device Module pinout Pinout differences between ConnectCore 6 and ConnectCore 6 Plus Signal use limitations Specifications for the ConnectCore 6 Plus Electrical characteristics Voltage supplies Power consumption Power consumption use cases...
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Transmitters with detachable antennas Europe ETSI and UKCA Maximum power and frequency specifications (Europe ETSI) CE and UKCA OEM labeling requirements Declarations of Conformity Approved antennas Bluetooth SIG-qualified hardware and firmware Japan Approval Label (MIC Marking) ConnectCore 6 Plus Hardware Reference Manual...
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About the ConnectCore 6 Plus The ConnectCore 6 Plus is an integrated platform solution with processor speed up to 1.2 GHz and pre-certified dual-band Wi-Fi (802.11a/b/g/n/ac) with Bluetooth 5.0 dual mode connectivity. Cloud Connector integration, as part of the Digi Linux and Android software platform support, offers secure remote management and web services capabilities through Digi Remote Manager.
Digi Device Cloud and Digi Remote Manager®, under the Remote Manager name. This phased process does not affect device functionality or the functionality of the web services and other features. However, you will find instances of both Device Cloud and Digi Remote Manager in some documentation, firmware, and user interfaces.
The ConnectCore 6 Plus module cannot be guaranteed operation due to the radio link and so should not be used for interlocks in safety critical devices such as machines or automotive applications. The ConnectCore 6 Plus module has not been approved for use in (this list is not exhaustive): nuclear applications explosive or flammable atmospheres There are no user serviceable components inside the ConnectCore 6 Plus module.
About the ConnectCore 6 Plus Block diagram The end user must be told how to remove power from the ConnectCore 6 Plus module or to locate the antennas 20 cm from humans or animals. Block diagram The figure below shows the block diagram of the NXP i.MX6QP application processor.
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1 µA VDD_ LDO10 0.9 - 3.6 +/-3% 3.3 V 300 mA 150 mV WLAN_ Signal name Turn on time (MAX) Turn off time (MAX) 150 µs VLDO2 1 ms VLDO3_MCA 300 µs 1 ms ConnectCore 6 Plus Hardware Reference Manual...
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VDD_SD2 NVCC_SD3 VGEN_3V3 PCIE_VPH 2.5V (VDDHIGH_CAP_2V5) The remaining I/O voltages must be set externally and are left open on the ConnectCore 6 Plus module. See the following table for operating ranges of the remaining I/O supplies. Power domain Typical NVCC_ENET 1.8 V...
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Plus module must provide the supplies listed in the table. But note that PMIC power domains 3.3 V—and LDO2/3/4/6/8 options—are dedicated power sources for supplying i.MX6QP power domains. The MCU-assist-specific power domain (VLDO3_MCA) available on the ConnectCore 6 Plus LGA pads is a power supply output that powers the on-module Kinetis processor.
The following diagram outlines the ConnectCore 6 Plus power supply. Bootstrap The ConnectCore 6 Plus module can be configured to boot from different devices and interfaces determined by the boot ROM. The configuration of the CPU booting process is done through:...
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CAUTION! A boot-from-fuses configuration is irreversible. BOOT_CFG1 register selects the boot device through BOOT_CFG1[7:4] bits: BOOT_CFG1[7:4] Boot device NOR/OneNAND (EIM) 0000 0001 Reserved 1xxx Raw NAND 0010 SSD/Hard Disk (SATA) 010x SD/eSD/SDXC 0011 Serial ROM (I2C/SPI) 011x MMC/eMMC ConnectCore 6 Plus Hardware Reference Manual...
However, this time the values of some registers are overridden using multiple GPIOs—which are latched during power-up. The following configuration is done internally in the ConnectCore 6 Plus module to enable booting from the internal eMMC memory:...
WLAN IEEE 802.11a/b/g/n/ac The 2.4 GHz band on the ConnectCore 6 Plus module supports 20/40 MHz bandwidths, and the 5 GHz band supports 20/40/80 MHz bandwidths. The following sections specify the performance of the WLAN IEEE 802.11a/b/g/n/ac interface on the ConnectCore 6 Plus module.
About the ConnectCore 6 Plus Wireless interfaces Receive sensitivity The following table lists typical receive sensitivity values for the ConnectCore 6 Plus module. Mode 802.11b 802.11ga 802.11n 802.11ac Modulation DBPS 64QA 64QA 64QA 256QA K-1/2 M-3/4 K-1/2 M-5/6 K-1/2 M-5/6...
Additional software development is required to implement MCA functionality. Supported devices The ConnectCore 6 Plus module is designed to support a Kinetis processor in a QFN48 package. See below for a list of compatible Kinetis processors that can be used in this package size:...
About the ConnectCore 6 Plus MCA hardware MCA pinout The table below contains the pinouts for the MCA unit on the ConnectCore 6 Plus module. Note The pinout information assumes you are using the NXP MKL14Z32VFT4 microcontroller. Using a different Kinetis microcontroller may change the functions available on the MCA pins.
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6 Plus TPM0_CH3 signal ON/OFF (pad D18). The source of TPM_CLKIN1 the MOSFET is connected to GND. This signal is reserved on the module and allows MCA to control ON/OFF signal ConnectCore 6 Plus Hardware Reference Manual...
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GND are placed close to this pin on ConnectCore 6 Plus SOM. MCA_SWD_CLK PTA0 TPM0_CH5 SWD_CLK AA22 MCA_IO25 PTA1 UART0_RX TPM2_CH0 AA23 MCA_IO6/PMIC_ Connected on ConnectCore 6 Plus SOM PTA2 GP_FB2 to PMIC signal GP_FB2. UART0_TX TPM2_CH1 MCA_SWD_DIO PTA3 I2C1_SCL ConnectCore 6 Plus Hardware Reference Manual...
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1x 100 nF + 1x1 µF capacitors connected to GND are placed close to this pin on ConnectCore 6 Plus SOM. MCA ground EXTAL0 PMIC_STBY_ Connected on ConnectCore 6 Plus SOM PTA18 to i.MX6QP processor signal PMIC_ STBY_REQ (ball F11) and PMIC signal UART1_RX SYS_EN/GPIO8 (ball B9).
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PTB3 signal and to i.MX6QP processor I2C2_ I2C0_SDA SDA/KEY_ROW3 signal (ball T7) over N- TPM2_CH1 channel MOSFET. MCA_IO7 PTB16 SPI1_MOSI UART0_RX TPM_CLKIN0 SPI1_MISO MCA_IO8 PTB17 SPI1_MISO UART0_TX TPM_CLKIN1 SPI1_MOSI ADC0_SE14 MCA_IO4 PTC0 EXTRG_IN CMP0_OUT ConnectCore 6 Plus Hardware Reference Manual...
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P6/RTC_ KL25 this pin can be configured as RTC_ CLKIN CLKIN signal. I2C1_SCL TPM0_CH0 ADC0_SE11 MCA_IO9 PTC2 I2C1_SDA TPM0_CH1 MCA_IO10 PTC3/LLWU_ UART1_RX TPM0_CH2 CLKOUT MCA_IO11 PTC4/LLWU_ SPI0_PCS0 UART1_TX TPM0_CH3 MCA_IO12 PTC5/LLWU_ SPI0_SCK LPTMR0_ALT2 CMP0_OUT ConnectCore 6 Plus Hardware Reference Manual...
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MCA and i.MX6QP SPI0_MISO processor. CSI0_ Connected to i.MX6QP processor signal PTD3 DAT9/ECSPI2_ CSI0_DAT9 (ball N5) and to LGA pad D5. SPI0_MISO This pin can be configured as a SPI MOSI MOSI UART2_TX ConnectCore 6 Plus Hardware Reference Manual...
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UART0_TX SPI1_MOSI The i.MX6QP pads listed above are connected to ConnectCore 6 Plus pads. If the MCA microcontroller firmware doesn’t use these signals, they are available on the carrier board and can be used in any of the alternative functions listed above.
MCA hardware Shared I2C bus The screenshot below shows how the I2C bus (I2C2) is used on ConnectCore 6 Plus module. The bus is shared between i.MX6QP processor and the PMIC, the MCA, and the cryptochip. The usage of N-channel MOSFET ensures the bus is fully isolated and allows the i.MX6QP processor to be shut off while MCA and PMIC are powered.
About the ConnectCore 6 Plus CryptoAuthentication device CryptoAuthentication device The ConnectCore 6 Plus includes an Atmel CryptoAuthentication Device. This is a highly secure cryptographic co-processor with secure hardware-based key storage. It includes the following features: Performs high-speed public key (PKI) algorithms (ECDSA and ECDH).
The module has an LGA pad structure based on 400 pads. See the following diagram for the general layout, which shows the top view of the module pinouts. The following table provides the pinout of the ConnectCore 6 Plus module. Additional timing and electrical information can be found in either the NXP i.MX6QP processor datasheet (www.nxp.com) or the Dialog DA9063 product datasheet...
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ALT2: wireless variants of ALT3: GPT_CLKIN the SOM. ALT4: ALT5: GPIO1_IO20 ALT6: ALT7: ALT0: - MCA_SWD_ LDO3_MCA Signal only available ALT1: PTA0 in variants carrying ALT2: - the MCA. ALT3: TMP0_CH5 ConnectCore 6 Plus Hardware Reference Manual...
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ALT6: - ALT7: - ALT0: SD1_DATA0 NVCC_SD1 SD1_DAT0 Signal only available ALT1: ECSPI5_MISO (VGEN_3V3) externally in non- ALT2: wireless variants of ALT3: GPT_ the SOM. CAPTURE1 ALT4: ALT5: GPIO1_IO16 ALT6: ALT7: LVDS1_TX2_N - NVCC_LVDS_2P5 ConnectCore 6 Plus Hardware Reference Manual...
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ALT7: - ALT0: - MCA_IO8 LDO3_MCA Signal only available ALT1: PTB17 in variants carrying ALT2: SPI1_MISO the MCA. ALT3: UART0_TX ALT4: TPM_CLKIN1 ALT5: SPI1_MOSI ALT6: - ALT7: - ALT0: ADC0_SE4a MCA_IO1 LDO3_MCA Signal only available ConnectCore 6 Plus Hardware Reference Manual...
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Signal only available ALT1: PTC7 in variants carrying ALT2: SPI0_MISO the MCA. ALT3: - ALT4: - ALT5: SPI0_MOSI ALT6: - ALT7: - MCA_IO16 ALT0: - LDO3_MCA Signal only available ALT1: PTD4/LLWU_ in variants carrying ConnectCore 6 Plus Hardware Reference Manual...
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ALT1: IPU2_DISP0_ DATA01 ALT2: ECSPI3_MOSI ALT3: ALT4: ALT5: GPIO4_IO22 ALT6: ALT7: AC10 MCA_VREFH VREFH A 100 nF capacitor connected to GND is placed close to this pin on ConnectCore 6 Plus SOM. Signal only available ConnectCore 6 Plus Hardware Reference Manual...
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1x 100nF + 1x1µF capacitors connected to GND are placed close to this pin on the ConnectCore 6 Plus SOM. RGMII_RXC ALT0: USB_H3_ NVCC_RGMII STROBE ALT1: RGMII_RXC ALT2: ALT3: ALT4: ConnectCore 6 Plus Hardware Reference Manual...
The following table lists the details of pinout differences between the ConnectCore 6 and the ConnectCore 6 Plus: ConnectCore ConnectCore 6 Plus Comments Unconnected PCM_IN PCM bus coming from the wireless transceiver used on the ConnectCore 6 Plus. ConnectCore 6 Plus Hardware Reference Manual...
It is recommended that you use another I2C port for connecting external devices to the ConnectCore 6 Plus module in order to avoid excessive bus load. NANDF_CS1/#MCA_INT (pad H21), CSI0_DAT11/ECSPI2_SS0 (pad A6), CSI0_ DAT8/ECSPI2_SCLK (pad D6), CSI0_DAT10/ECSPI2_MISO (pad K5) and CSI0_ DAT9/ECSPI2_MOSI (pad D5) are connected to MCA processor.
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SPI bus shared between thei.MX6QP and MCA processors. The usage and availability of these signals depends on the firmware running in the MCA processor. ON/OFF (pad D18) signal is connected to PMIC and MCA. #POR (pad E18) is connected to PMIC and i.MX6QP processor. ConnectCore 6 Plus Hardware Reference Manual...
Specifications for the ConnectCore 6 Plus Electrical characteristics Power consumption Environmental specifications ConnectCore 6 Plus Hardware Reference Manual...
1.71 Note No specific ESD protection components have been implemented on the ConnectCore 6 Plus module. ESD protection level on the module’s I/Os is the same as what is specified in the NXP datasheet. Any required ESD protection must be implemented on the carrier board.
Specifications for the ConnectCore 6 Plus Environmental specifications Global power consumption The following table lists the global power consumption of the ConnectCore 6 and ConnectCore 6 Plus system-on-module when the system is under the use cases described above: Digi Embedded Yocto 2.4...
Depending on the operating system, the junction temperature is displayed in milli °C or °C. The ConnectCore 6 Plus multichip module was designed to provide customers with unique options to simplify and support the implementation of thermal management approaches in their designs, as...
Assembly instructions Moisture sensitivity and shelf life Mounting Coplanarity Solder paste print Stencil SMT pick and place SMT process parameter reference Reflow profile ConnectCore 6 Plus Hardware Reference Manual...
Moisture sensitivity and shelf life Moisture sensitivity and shelf life The ConnectCore 6 Plus module is classified as a Level 3 Moisture Sensitive Device in accordance with IPC/JEDEC J-STD-020. 1. Calculated shelf life in sealed packaging: 12 months at <40°C and <90% relative humidity (RH).
Reflow profile Digi recommends the following: SoM temperature below 238°C during reflow cycle. Time Above Liquidus (TAL) between 55 and 65 seconds. Use of 40AWG K-type thermal couple and M.O.L.E. or equivalent thermal profiler. ConnectCore 6 Plus Hardware Reference Manual...
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Digi recommends X-ray analysis after reflow to confirm proper mounting and solder reflow. The ConnectCore 6 Plus is approved to withstand a total of four (4) reflow cycles. Two (2) reflow cycles are required for manufacturing the ConnectCore 6 Plus module. Two (2) reflow cycles are remaining for mounting the module on the carrier board.
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Regulatory information and certifications United States FCC Canada (ISED) Europe ETSI and UKCA Bluetooth SIG-qualified hardware and firmware Japan ConnectCore 6 Plus Hardware Reference Manual...
United States FCC United States FCC The ConnectCore 6 Plus module complies with Part 15 of the FCC rules and regulations. Compliance with the labeling requirements, FCC notices and antenna usage guidelines is required. To fulfill FCC Certification, the OEM must comply with the following regulations: The system integrator must ensure that the text on top side of the module is placed on the outside of the final product.
Maximum power and frequency specifications (FCC) Maximum transmit Peak power at antenna antenna RF band gain Technology connector Frequencies 2.4 GHz 2.5 dBi BT + EDR 8.8 mW [BW 1 MHz] x 79 non-overlapping channels, # (center freq. MHz): * [2400 - 2483.5 MHz]: 0 (+9.5 dBm) (2402) to 78 (2480) Bluetooth LE...
United States FCC FCC notices IMPORTANT: The ConnectCore 6 Plus module has been certified by the FCC for use with other products without any further certification (as per FCC section 2.1091). Modifications not expressly approved by Digi could void the user's authority to operate the equipment.
Digi International Inc. has not approved any changes or modifications to this device by the user. Any changes or modifications could void the user’s authority to operate the equipment.
Europe ETSI and UKCA The ConnectCore 6 Plus module has been certified for use in several European countries. For a complete list, refer to www.digi.com. If the ConnectCore 6 Plus module is incorporated into a product, the manufacturer must ensure compliance of the final product with articles 3.1a and 3.1b of the RE Directive (Radio Equipment...
Maximum power and frequency specifications (Europe ETSI) Maximum transmit Peak power at antenna antenna RF band gain Technology connector Frequencies 2.4 GHz 2.5 dBi BT + EDR 4.9 mW (+6.9 [BW 1 MHz] x 79 non-overlapping channels, # (center freq. MHz): * [2400 - 2483.5 MHz]: 0 dBm) (2402) to 78 (2480) Bluetooth LE...
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Maximum transmit Peak power at antenna antenna RF band gain Technology connector Frequencies (+13.5 dBm) (5210) * [5250 - 5350 MHz]: 58 (5290) * [5470 - 5725 MHz]: 106 (5530) 7.9 mW (+9 * [5725 - 5850 MHz]: 155 (5775) dBm)
The CE marking must have a height of at least 5 mm except where this is not possible on account of the nature of the apparatus. The CE marking must be affixed visibly, legibly, and indelibly. UK Conformity Assessed (UKCA) labeling requirements ConnectCore 6 Plus Hardware Reference Manual...
ConnectCore 6 Plus module. Bluetooth SIG-qualified hardware and firmware The ConnectCore 6 Plus is qualified by the Bluetooth SIG. At the hardware level, the ConnectCore 6 Plus is listed as a Bluetooth 5.0 Controller Subsystem under the following identifiers: QD ID # 169178...
End product label should support radio marking for Japan. If not, radio marking shall be documented in the user manual. Note The warning “5GHz (W52, W53) band is for indoor use only (Excluding communication with registered stations)” must go on the end product – or E Label (Display). ConnectCore 6 Plus Hardware Reference Manual...
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