Table of Contents
Advertisement
3
Packages
3.1
Package summary
The package selection must take into account the constraints that are strongly dependent upon the application.
The list below summarizes the most frequent ones:
•
Amount of interfaces required: Some interfaces may not be available on some packages. Some interfaces
combinations may not be possible on some packages.
•
PCB technology constrains: Small pitch and high-ball density may require more PCB layers and
higher‑class PCB.
•
Package height
•
PCB available area
•
Noise emission or signal integrity of high-speed interfaces
•
Smaller packages usually provide better signal integrity. This is further enhanced as small-pitch and high-ball
density requires multilayer PCBs that allow better supply/ground distribution.
•
Compatibility with other devices
Package
UFQFN48
LQFP48
LQFP64
WLCSP90
LQFP100
UFBGA132
LQFP144
UFBGA169
1. Body size, excluding pins for LQFP.
2. Maximum value.
AN5373 - Rev 1
Table 1.
Package summary for STM32U575/585
(1)
Size (mm)
Pitch (mm)
7 x 7
0.5
7 x 7
0.5
10 x 10
0.5
4.20 x 3.95
0.4
14 x 14
0.5
7 x 7
0.5
20 x 20
0.5
7 x 7
0.5
(2)
Height (mm)
Without SMPS
0.6
X
1.6
X
1.6
X
0.59
-
1.6
X
0.6
X
1.6
X
0.6
X
AN5373
Packages
With SMPS
X
X
X
X
X
X
X
X
page 14/37
Hide quick links:
Advertisement
Table of Contents
Need help?
Do you have a question about the STM32U575 Series and is the answer not in the manual?
Questions and answers