Usually the noise current should flows thought the soldering pad of decoupling capacitor CB. The following routing and
placement for single-side assembled boards is recommended:
The following routing and placement for multi-layer PCB is recommended. Note that despite the capacitor is placed on
the opposite side as the MCU, this solution is the best for high-density board assembly.
L1 (MCU)
L2 (GND)
L3 (VCC)
L4
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Figure 8. Power Supply decoupling on single-side assembled boards
Figure 9. Power Supply decoupling on double-side assembled boards
VCC
MCU
VSS
Document No. 002-09375 Rev. *B
Recommendation for Hardware Setup 32-Bit FR81S Family
L4
L3 (VCC)
L2 (GND)
L1 (MCU)
11
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