Reliability Guidelines; Table 3. Reliability Guidelines - Intel E7500 Thermal Design Manual

Reference Thermal Solutions
6.4

Reliability Guidelines

Each motherboard, heatsink and attach combination may vary the mechanical loading of the
component. Based on the end user environment, the user should define the appropriate reliability
test criteria and carefully evaluate the completed assembly prior to use in high volume. Some
general recommendations are shown in Table 3.

Table 3. Reliability Guidelines

Test
Mechanical Shock
Random Vibration
Temperature Life
Thermal Cycling
Humidity
NOTES:
1. It is recommended that the above tests are performed on a sample size of at least 12
assemblies from 3 lots of material.
2. Additional Pass/Fail Criteria may be added at the discretion of the user.
30
Test Profile
50 g, board level, 11 msec, 3 shocks/axis
7.3 g, board level, 45 min/axis, 50 Hz to
2000 Hz
85 °C, 2000 hours total, checkpoints at 168,
500, 1000, and 2000 hours
-5 °C to +70 °C, 500 cycles
85% relative humidity, 55 °C, 1000 hours
®
Intel E7500/E7505 Chipset MCH Thermal Design Guide
Pass/Fail Criteria
Visual Check and Electrical
Functional Test
Visual Check and Electrical
Functional Test
Visual Check
Visual Check
Visual Check
R