Figure 3. Mch Package Dimensions (Top View) - Intel E7500 Thermal Design Manual

Chipset memory controller hub (mch) thermal and mechanical design guidelines
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Figure 3. MCH Package Dimensions (Top View)

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Detail A
NOTES:
1. All dimensions are in millimeters.
2. All dimensions and tolerances conform to ANSI Y14.5M–1982.
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21
25
Solder Resist Opening
(n)x 0.650 ± 0.040
∅ ∅ ∅ ∅ 00.200 L C A S B
∅ ∅ ∅ ∅ 00.071 L C
Metal Edge
(n)x ∅ 0.790 ± 0.025
(n)x 0.025 Min
Intel
20
18
16
14
12
10
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15
13
11
19
20.320
40.640
2x 42.500 ±0.100
0.200 A B
®
E7500/E7505 Chipset MCH Thermal Design Guide
Detail A
21.250
1.270
8
6
4
2
9
7
5
3
1
1.270
MCH_Pkg_TopView
R

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